Dual-frequency patch antenna compact stacked structure
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Solution Overview
Problem
Conventional dual-frequency patch antennas are bulky, heavy, and costly due to their complex structure, which limits their size reduction and increases manufacturing expenses.
Innovation Solution
The proposed dual-frequency patch antennas employ a compact stacked structure with circuitry formed below the ground plane using printed circuit board assembly (PCBA) processes, reducing the number of layers and integrating dielectric and conductive layers with circuitry to minimize size, weight, and cost, while utilizing a digital cable for signal processing in communication devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional dual-frequency patch antennas use separate metal sheets and multiple dielectric layers, then dual-frequency operation is achieved, but the antenna becomes bulky, heavy, and costly
Solution Approach 1:
The patent merges two separate patch antenna structures into a single integrated patch that operates at both frequencies. The ground plane is configured with specific geometric features (such as complementary split-ring resonators or irregular shapes) that enable dual-frequency resonance in one continuous structure, eliminating the need for separate metal sheets and reducing overall antenna volume.
Solution Approach 2:
The patent employs nested dielectric layers where multiple dielectric substrates are stacked with the patch antenna embedded within them. The dielectric layers are arranged in a compact configuration where each layer serves multiple functions (support, insulation, and resonance enhancement), allowing the antenna to achieve dual-frequency operation in a space-efficient manner.
2Adaptability or versatility
If conventional dual-frequency patch antennas use multiple separate layers, then dual-frequency operation is achieved, but the antenna weight increases
Solution Approach 1:
The patent combines multiple functional layers into fewer integrated layers. The ground plane structure incorporates resonant elements that provide dual-frequency operation, reducing the need for separate patch sheets and associated dielectric layers, thereby decreasing overall antenna weight.
Solution Approach 2:
The patent uses composite dielectric materials with optimized permittivity values that enable dual-frequency resonance with thinner layer configurations. The ground plane may also use composite metallic structures or patterns that provide dual-frequency characteristics, reducing the total material mass required.
3Adaptability or versatility
If conventional dual-frequency patch antennas use complex multi-layer structures, then dual-frequency operation is achieved, but manufacturing cost increases
Solution Approach 1:
The patent reduces the number of manufacturing steps by merging multiple layers into fewer integrated structures. The ground plane is fabricated as a single piece with integrated resonant features, and dielectric layers are minimized to essential support structures, simplifying the lamination and assembly processes.
Solution Approach 2:
The patent designs the ground plane and dielectric layers to serve multiple functions simultaneously: structural support, electrical insulation, and frequency-selective resonance. This multi-functionality reduces the total component count and simplifies manufacturing by eliminating the need for separate specialized layers for each function.
4Ease of operation
If circuitry is formed adjacent to or on a separate board from the ground plane, then signal processing is achieved, but the overall antenna assembly size and cost increase
Solution Approach 1:
The patent integrates the circuitry layer directly with the ground plane structure, forming a unified multi-layer assembly. The circuitry is embedded within or on the same substrate as the ground plane, eliminating the need for separate circuit boards and reducing the overall assembly volume.
Solution Approach 2:
The patent transitions from a planar arrangement where circuitry is on a separate board to a vertical integration where circuitry layers are stacked within the same antenna assembly. This three-dimensional integration reduces the horizontal footprint and overall assembly size.
Data Source
Figure 1A~1B
Figure 1C~1E
Figure 2A~2C
AI summary
There is disclosed a dual-frequency patch antenna comprising a first conductive element configured to receive global navigation satellite system, GNSS, signals at a first frequency band; a second conductive element configured to receive GNSS signals at a second frequency band; a ground plane; a first dielectric material disposed between the first conductive element and the second conductive element; a second dielectric material disposed between the second conductive element and the ground plane; a routing and placement layer; a third dielectric material disposed between the ground plane and the routing and placement layer; circuitry on the routing and placement layer, the circuitry being electrically coupled to at least one of the first conductive element or the second conductive element, and configured to provide frequency selection, down conversion, and digitization of the GNSS signals at the first frequency band and the GNSS signals at the second frequency band; wherein edges of the first conductive element and the first dielectric material are rotated by between about 30° to 60° relative to edges of the second conductive element and the second dielectric material. Methods of forming such antenna are also disclosed.