Dual-Frequency Substrate Heating for Uniform Semiconductor Annealing
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Solution Overview
Problem
In the heat treatment process for semiconductor substrates using electromagnetic waves, non-uniform heating can cause warping or cracking of the substrates.
Innovation Solution
A substrate processing apparatus that uses a combination of two electromagnetic waves with controlled frequencies and phase differences to achieve uniform heating, employing a process chamber, electromagnetic wave sources, and a frequency controller to adjust the electromagnetic field distribution within the chamber.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a single electromagnetic wave source is used for heating the substrate, then the heating process is simple, but the heating uniformity is poor causing substrate warping or cracking
Solution Approach 1:
The single electromagnetic wave source is divided into multiple electromagnetic wave sources (first and second electromagnetic wave sources). Each source operates independently to heat different regions of the substrate, thereby improving heating uniformity while avoiding the warping and cracking caused by non-uniform heating from a single source.
2Manufacturing precision
If multiple electromagnetic wave sources are used to improve heating uniformity, then heating uniformity improves, but the device complexity increases
Solution Approach 1:
The frequencies of the multiple electromagnetic wave sources are set to different values (first frequency and second frequency). This parameter differentiation allows each wave source to contribute uniquely to the heating process, improving overall heating uniformity while managing system complexity through controlled frequency variation.
Solution Approach 2:
The electromagnetic wave sources operate in a coordinated periodic manner with controlled phase differences. By adjusting the phase relationships between the waves from different sources, the system achieves constructive and destructive interference patterns that promote uniform energy distribution across the substrate surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures more uniform heating distributions, reducing the likelihood of substrate warping or cracking and improving the overall processing consistency.
Implementation Method 1
a heat treatment process (annealing process) using an electromagnetic wave
Implementation Method 2
a frequency controller configured to be capable of controlling at least one of a frequency of the first electromagnetic wave or a frequency of the second electromagnetic wave
Data Source
AI summary
There is provided a technique capable of improving the uniformity of heating the substrate in the heat treatment process using the electromagnetic wave. The technique includes a process chamber in which a substrate is processed; an electromagnetic wave source configured to output a first electromagnetic wave and a second electromagnetic wave at least partially at the same time to the process chamber; and a frequency controller configured to be capable of controlling at least one of a frequency of the first electromagnetic wave or a frequency of the second electromagnetic wave.