Dual-Gate GaN HEMT Structure for Precise Pinch-Off Voltage Control

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Solution Overview

Problem

High-electron-mobility transistors (HEMTs), particularly those using GaN, face challenges in controlling the depletion mode pinch-off voltage, which is typically higher than -6V, necessitating improved gate control and subthreshold behavior for low voltage applications like GaN integrated circuits.

Innovation Solution

The implementation of a structure comprising a depletion mode gate and an enhancement mode gate connected together, with an isolation region between them, utilizing field plates and epitaxially grown p-type doped GaN layers, forming a metal-insulator-semiconductor (MIS) capacitor, to achieve precise control over the pinch-off voltage without additional process complexity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a conventional HEMT structure with single gate is used, then the device can operate at high frequencies, but the depletion mode pinch-off voltage cannot be controlled below -6V

Engineering Contradiction:
Improvepinch-off voltage controlVSAvoidvoltage range for low voltage applications
Core Design Contradiction:
Measurement precisionVSAdaptability or versatility

Solution Approach 1:

The gate is divided into two independent gates: an enhancement mode gate and a depletion mode gate. Each gate can be independently controlled to achieve different operating modes. The enhancement mode gate provides positive threshold voltage control while the depletion mode gate provides negative threshold voltage control, enabling precise pinch-off voltage control below -6V that cannot be achieved with a conventional single gate structure.

Inventive Principle:
Principle #1Segmentation

2Measurement precision

If additional process complexity is introduced to achieve multiple threshold modes, then better voltage control is possible, but manufacturing complexity increases

Engineering Contradiction:
ImproveVt control precisionVSAvoidprocess complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

Both enhancement mode and depletion mode gates are formed using the same field plate structure and identical semiconductor material layers (AlGaN/GaN heterostructure). The two gates share common manufacturing processes including epitaxial growth, photolithography, and metallization steps. This merging of processes achieves multiple threshold modes without significantly increasing manufacturing complexity.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration provides significant improvement in gate control and subthreshold behavior, enabling the generation of multiple threshold depletion modes with enhanced Vt control, suitable for low voltage applications without increasing process complexity.

Implementation Method 1

forming a metal-insulator-semiconductor (MIS) capacitor

Methodology Applied
Scientific EffectCapacitance: Capacitance

Implementation Method 2

forming at least one depletion mode gate comprising a field plate on a conductive material over a semiconductor material

Methodology Applied
Scientific EffectElectric field: Electric Field

Data Source

PatentUS20240079405A1High-electron-mobility transistor
Publication Date: 2024.03.07 GLOBALFOUNDRIES US INC
  • US20240079405A1 patent drawing
  • US20240079405A1 patent drawing
  • US20240079405A1 patent drawing

AI summary

The present disclosure relates to semiconductor structures and, more particularly, to a high-electron-mobility transistor and methods of manufacture. The structure includes: at least one depletion mode gate on a conductive material over a semiconductor material; and at least one enhancement mode gate electrically connected to the at least one depletion mode gate and over the semiconductor material.