Dual-Group Chip Contacts for Flip-Chip and Wire-Bonding Adaptability
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Solution Overview
Problem
Existing chip designs are limited by restrictions that prevent their use in different chip packages, reducing their versatility, as they are typically optimized for a single application and connected using either flip-chip or wire-bonding technology, but not both efficiently.
Innovation Solution
The design incorporates additional chip contacts and connecting conductors on a passivating layer, allowing for both wire-bonding and flip-chip connections, enabling a chip to be connected to package contacts with preset assignments and facilitating cross-connections, thereby enabling the creation of double-chip packages and adaptability across various chip packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a chip is designed with contacts optimized for a single connection method (flip-chip or wire-bonding), then the connection reliability for that specific method is improved, but the adaptability to different chip packages is reduced
Solution Approach 1:
The chip is designed with two groups of contacts: first contacts for flip-chip connection and second contacts for wire-bonding connection. This multi-functional contact design allows the same chip to be reliably connected using either method, depending on the specific package requirements, thus achieving both connection reliability and adaptability to different chip packages.
Solution Approach 2:
The contact structure is segmented into two distinct groups: first contacts arranged in a first pattern for flip-chip connection and second contacts arranged in a second pattern for wire-bonding connection. This segmentation allows each contact group to be optimized for its specific connection method while maintaining overall versatility.
2Adaptability or versatility
If additional chip contacts and connecting conductors are provided on the passivating layer, then the versatility and adaptability of the chip to different packages is improved, but the device complexity increases
Solution Approach 1:
The second contacts and connecting conductors are integrated into the passivating layer during the chip manufacturing process, before the chip is packaged. This preliminary integration of additional contact structures allows the chip to be prepared for multiple connection methods without adding complexity to the final assembly process or requiring additional packaging steps.
Solution Approach 2:
The second contacts and their connecting conductors are merged into the passivating layer structure, combining multiple functions (protection, additional contacts, and electrical connections) into a single integrated layer, thereby minimizing the increase in device complexity while maximizing versatility.
3Manufacturing precision
If a chip is designed for use in a specific chip package with preset contact assignments, then the manufacturing precision and connection accuracy are improved, but the ease of operation and reconfigurability are reduced
Solution Approach 1:
The chip contact configuration is made dynamic by providing both first contacts for flip-chip connection and second contacts for wire-bonding connection, allowing the connection method to be selected or changed based on different package requirements while maintaining precise alignment for each method through their respective contact patterns.
Data Source
AI summary
A chip (1) has a substrate (2), an integrated circuit (3) provided on the substrate (2), a plurality of conductor zones (ME1, ME2, ME3, ME4, ME5) and a passivating layer (5) provided to protect the conductor zones and the integrated circuit, through-holes (6, 7) being provided in the passivating layer (5) through which chip contacts (8, 9) are accessible, wherein additional chip contacts (10, 11) and connecting conductors (12, 13) are provided on the passivating layer (5) and wherein each additional chip contact has an electrically conductive connection to a chip contact via a connecting conductor.