Dual Half-Antenna Subassembly for mmWave Frequency Coverage
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Solution Overview
Problem
Current antenna packages for 5G mm wave frequencies (24 to 43.5 GHz) face limitations in space, are limited to single frequency segments, and have low fractional bandwidth, necessitating a solution that provides multi-frequency coverage with improved performance and reduced thickness for mobile devices.
Innovation Solution
A dual half-antenna subassembly configuration using flex substrates formed from printed circuit boards, arranged in a 'butterfly' shape with feed lines matching the impedance of antenna elements, allowing for increased fractional bandwidth and support across multiple frequency bands.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional antenna designs are used for mm wave frequencies, then each frequency segment can be handled by an individual RFIC/antenna package, but the device requires multiple separate packages for different frequency bands, increasing overall device complexity and space requirements
Solution Approach 1:
The patent implements a universal antenna package design where a single RFIC/antenna package can handle multiple frequency segments (27.5-28.35 GHz, 37-38.6 GHz, and 38.6-40 GHz) through reconfigurable antenna elements. The antenna structure includes multiple feed lines and radiation elements that can be selectively activated or tuned to operate across different frequency bands, eliminating the need for separate dedicated packages for each frequency segment.
Solution Approach 2:
The antenna package is divided into distinct antenna elements and feed line configurations that can be independently controlled. Each antenna element can be configured for specific frequency segments through selective activation of feed lines and impedance matching networks, allowing the system to segment frequency handling within a unified physical package structure.
2Adaptability or versatility
If traditional antenna packages are used, then single frequency segment operation is achieved, but the fractional bandwidth is typically less than 20%, limiting operational flexibility
Solution Approach 1:
The antenna package incorporates dynamic reconfiguration capabilities through switchable feed line connections and可调 impedance matching networks. This allows the antenna system to dynamically adapt its electrical characteristics to maintain optimal performance across different frequency segments, with each antenna element being可调 to resonate at different frequencies by changing the effective electrical length or impedance through switching different feed line configurations.
3Volume of moving object
If current antenna package designs are used, then manufacturing is simplified, but the package thickness is not reduced and space within mobile devices is not optimized
Solution Approach 1:
The patent employs a planar antenna element design with feed lines routed on the same substrate plane, transitioning from traditional three-dimensional stacked configurations to a two-dimensional layout. This planar integration allows the antenna elements and RFIC to be mounted in a coplanar arrangement, reducing the vertical profile and package thickness while maintaining all necessary electrical connections through surface-mounted feed line structures.
Data Source
AI summary
An antenna package comprising a chip package including a plurality of feed lines, a first half antenna subassembly electrically coupled to the feed lines, and a second half antenna subassembly electrically coupled to the feed lines, wherein the first and second half antenna subassemblies point away from each other in a direction substantially perpendicular to the chip package. The antenna subassemblies may be millimeter (mm) wave antennas covering from approximately 24 to 43.5 GHz. The antenna subassemblies include a flex substrate formed from printed circuit boards (PCB) or flex-film PCB.