Dual Heat Absorber Layout for Electronic Device Hot Spot Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In electronic devices, the temperature difference between heat-generating components and heat dissipation units is small, leading to inefficient heat transfer, as the heat dissipation unit's temperature rises, limiting the effectiveness of heat absorption and dissipation.
Innovation Solution
The implementation of a dual heat absorption system, where a first heat absorber handles continuous heat generation components and a second heat absorber, positioned separately, manages heat from components like camera and antenna modules, using thermally conductive materials and controlled heat dissipation sheets to efficiently absorb and dissipate heat.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single heat dissipation unit is used to absorb heat from multiple electronic components, then the structure is simple, but the temperature difference between heat-generating components and heat dissipation unit becomes small, reducing heat transfer efficiency
Solution Approach 1:
The patent divides the heat dissipation function into multiple independent heat dissipation units (first heat dissipation unit and second heat dissipation unit) that are spatially separated. Each unit is positioned near specific heat-generating components (camera module and antenna module respectively), creating dedicated heat transfer pathways that maintain large temperature differences and improve heat transfer efficiency while avoiding the thermal saturation problem of a single centralized heat dissipation unit.
2Temperature
If heat dissipation unit temperature rises, then heat absorption capacity increases, but temperature difference with heat-generating components decreases, limiting further heat absorption
Solution Approach 1:
By segmenting the heat dissipation system into multiple spatially distributed units, each unit handles heat from specific components independently. This prevents any single unit from experiencing excessive temperature rise that would reduce the temperature gradient, as heat is distributed across multiple dissipation pathways with separate thermal zones.
Solution Approach 2:
The patent transitions from a single-point heat dissipation approach to a distributed spatial arrangement of heat dissipation units. By positioning heat dissipation units at different locations within the device housing, the system creates multiple thermal zones and heat transfer pathways in three-dimensional space, allowing simultaneous heat absorption from multiple sources without thermal interference between dissipation units.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat absorption and dissipation efficiency, maintaining low temperatures for heat-generating components and reducing thermal energy transfer to the housing, thereby stabilizing device performance and preventing hot spots.
Implementation Method 1
a first heat absorber that absorbs heat of a first heat generating source composed of a first heat generating component generating heat inside the electronic device
Implementation Method 2
a second heat absorber that absorbs heat of a second heat generating source composed of a second heat generating component and that is disposed at a position separated from the first heat absorber
Data Source
AI summary
An electronic device includes: a first heat absorber that absorbs heat of a first heat generating source composed of a first heat generating component generating heat inside the electronic device, and operating during substantially an entire period of an operation period during which the electronic device is configured to receive an input operation of a user on a screen of the electronic device; and a second heat absorber that absorbs heat of a second heat generating source composed of a second heat generating component and that is disposed at a position separated from the first heat absorber, the second heat generating component operating during a part of the operation period.