Dual Heat Spreader Semiconductor Package for Compact Cooling
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Solution Overview
Problem
The challenge in semiconductor packaging is to enhance thermal and electrical performance while maintaining a compact package size, as chip sizes shrink and thermal requirements increase, often necessitating larger external heat sinks due to limited heat dissipation area within the package.
Innovation Solution
A molded semiconductor package design featuring double-side heat spreaders with heat dissipative structures protruding from the mold compound, allowing for parallel fluid channeling to enhance heat dissipation, potentially reducing the need for additional heat sinks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the pad size is increased to enlarge the heat dissipation area, then thermal performance is improved, but package size increases
Solution Approach 1:
The patent transitions from single-sided heat dissipation to dual-sided heat dissipation by adding a first heat spreader on the front side and a second heat spreader on the back side of the semiconductor die. This dimensional change allows heat to be dissipated from both sides of the package simultaneously, effectively doubling the heat dissipation area without increasing the package footprint.
Solution Approach 2:
The heat spreaders are embedded within the mold compound, with portions of the heat spreaders nested inside the molding material. This nesting approach allows the heat dissipation structures to be integrated into the package volume without increasing the external package dimensions, as the heat spreaders utilize the internal space within the mold compound.
2Temperature
If a larger external heat sink is used for secondary heat dissipation, then thermal performance is improved, but device complexity increases
Solution Approach 1:
The patent merges the heat dissipation function directly into the package structure by integrating heat spreaders with high thermal conductivity materials into the mold compound. This consolidation eliminates the need for separate external heat sinks, as the package itself becomes the primary heat dissipation component, thereby reducing overall device complexity.
Solution Approach 2:
The mold compound serves multiple functions: it provides mechanical support, electrical insulation, and thermal management. By embedding heat spreaders within the mold compound, the package structure achieves multi-functionality, combining structural and thermal management roles in a single integrated component rather than requiring separate dedicated heat sinking elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves cooling efficiency by dissipating heat effectively on both sides of the package, potentially reducing the requirement for external heat sinks and enhancing thermal performance within the constrained package size.
Implementation Method 1
a first heat spreader partly embedded in the mold compound and thermally coupled to a first side of the semiconductor die; and a second heat spreader partly embedded in the mold compound and thermally coupled to a second side of the semiconductor die
Implementation Method 2
the mold compound is configured to channel a fluid over the at least one heat dissipative structure in a direction parallel to the first side of the power semiconductor die
Data Source
AI summary
A molded semiconductor package includes: a semiconductor die embedded in a mold compound; a first heat spreader partly embedded in the mold compound and thermally coupled to a first side of the semiconductor die; and a second heat spreader partly embedded in the mold compound and thermally coupled to a second side of the semiconductor die opposite the first side. The first heat spreader includes at least one heat dissipative structure protruding from a side of the first heat spreader uncovered by the mold compound and facing away from the semiconductor die. The mold compound is configured to channel a fluid over the at least one heat dissipative structure in a direction parallel to the first side of the power semiconductor die. Corresponding methods of production and electronic assemblies are also described.