Dual Heater Liquid Processing Apparatus for Wafer Temperature Control
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Solution Overview
Problem
Existing liquid processing apparatuses face challenges in supplying high-temperature process liquids while maintaining heat resistance and chemical resistance for components like pumps and filters, which are often compromised by the high temperature and chemical nature of the liquids.
Innovation Solution
The apparatus employs a dual temperature adjustment mechanism with a first heater maintaining the liquid at a lower temperature and a second heater increasing it further, using a switching valve to control the flow and heat distribution, ensuring that components are not exposed to extreme temperatures and thus maintaining necessary resistances.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the process liquid is heated to high temperature to activate the reaction, then the liquid processing efficiency is improved, but the heat resistance and chemical resistance of components like pumps and filters deteriorate
Solution Approach 1:
The circulation system is divided into two separate circulation paths: a first circulation path that exposes components (pump, filter) to liquid at a lower first temperature, and a second circulation path that heats the liquid to a higher second temperature for processing. This segmentation allows components to operate in a less harsh environment while still achieving high-temperature processing benefits.
Solution Approach 2:
The liquid is pre-heated to the first temperature in the first circulation path before being transferred to the second circulation path for further heating to the second temperature. This preliminary action protects components from immediate exposure to extreme temperatures while still preparing the liquid for high-temperature processing.
2Device complexity
If a single circulation system is used to heat the liquid, then the device complexity is reduced, but the components are exposed to extreme temperatures causing deterioration
Solution Approach 1:
The circulation system is segmented into two distinct circulation paths with different temperature zones. The first circulation path handles liquid at a lower temperature to protect components, while the second circulation path handles liquid at the required high processing temperature. This segmentation increases structural complexity but is necessary to maintain component reliability.
Solution Approach 2:
The system uses an intermediary approach where the liquid itself acts as a mediator between the two temperature zones. The liquid is heated in the first circulation path to a moderate temperature, then transferred to the second circulation path for further heating to the target high temperature, allowing components to avoid direct exposure to extreme conditions.
3Use of energy by moving object
If components are exposed to high-temperature process liquid, then the heating efficiency is improved, but the cost of heat-resistant components increases
Solution Approach 1:
The system segments the heating process into two stages across two circulation paths. Standard components (pump, filter) are placed in the first circulation path where they only handle liquid at a lower first temperature, reducing the need for expensive heat-resistant materials. The second circulation path handles the high-temperature heating function separately.
Solution Approach 2:
The system effectively uses cheaper, non-heat-resistant components in the first circulation path by separating their function from the high-temperature processing function. This allows the use of standard, cost-effective components for filtration and pumping rather than requiring expensive heat-resistant versions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This setup allows for the supply of high-temperature process liquids while protecting the apparatus components from excessive heat and chemical damage, reducing costs and ensuring reliable operation.
Implementation Method 1
a first heater that heats the first liquid to a first temperature
Implementation Method 2
a second heater installed on the second circulation line to heat the first liquid to a supply temperature higher than the first temperature
Implementation Method 3
a pump installed on the first circulation line
Data Source
AI summary
Disclosed are a liquid processing apparatus and a liquid processing method. The liquid processing apparatus includes an ejection port ejecting a first liquid to a wafer, a first liquid supply mechanism supplying sulphuric acid to the ejection port, and a second liquid supply mechanism supplying hydrogen peroxide solution to the ejection port. The first liquid supply mechanism includes a first temperature adjustment mechanism maintaining the first liquid heated to a first temperature, a second temperature adjustment mechanism connected to the first temperature adjustment mechanism, and an ejection line connecting the second temperature adjustment mechanism with the ejection port. The second temperature adjustment mechanism includes a second circulation line and a second heater. The ejection line connects the second circulation line through a switching valve at a location further downstream than the second heater.