Dual Holding Plate Substrate Processing Apparatus
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Solution Overview
Problem
Existing substrate processing systems face challenges in efficiently performing multiple types of processing without complicating the apparatus structure, particularly in managing fluid flow between the substrate and processing units, which affects gas and liquid distribution and contamination control.
Innovation Solution
A substrate processing apparatus with a rotational shaft and selectively connectable first and second holding plates, allowing for adjustable gaps to optimize fluid flow based on the type of processing, using the first holding plate for gas supply and the second for liquid supply, thereby simplifying the structure and enhancing processing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a lift driving mechanism is mounted in the substrate holding member to adjust the gap, then the gap can be adjusted for different processing needs, but the structure becomes complicated and particle generation sources increase
Solution Approach 1:
The substrate holding member is segmented into two separate components: a rotation body that rotates with the substrate and a support member that remains stationary. The gap adjustment is achieved by changing which component holds the substrate, rather than making the rotating component itself adjustable. This segmentation eliminates the need for complex lifting mechanisms in the rotating part while still providing gap adjustment capability.
Solution Approach 2:
The gap adjustment function is extracted from the rotating substrate holding member and implemented through a separate, stationary support member. By taking out the adjustment mechanism from the rotating component, the invention avoids adding complexity to the rotating mass while maintaining the ability to adjust gaps for different processing requirements.
2Productivity
If the space below the substrate is made narrow, then gas can be supplied efficiently to suppress contaminants, but processing liquid cannot flow smoothly to the peripheral edge
Solution Approach 1:
The invention dynamically adjusts the gap size based on the processing type. For gas processing, a narrow gap is used to improve gas supply efficiency and contaminant suppression. For liquid processing, a wide gap is used to allow smooth liquid flow to the peripheral edge. This dynamic adaptation is achieved by selecting different holding configurations rather than using a fixed structure.
Solution Approach 2:
The gap parameter is changed according to the processing requirements. The invention provides a mechanism to vary the gap size between the substrate and the support structure, allowing optimization of gas flow characteristics for contaminant suppression during gas processing, and optimization of liquid flow characteristics for smooth liquid distribution during liquid processing.
3Adaptability or versatility
If a single substrate processing unit is used for multiple processings, then apparatus costs and footprint are reduced, but the structure becomes more complex to accommodate different processing requirements
Solution Approach 1:
The substrate holding mechanism is designed with universal functionality to accommodate different processing types. By using a configurable support member that can be positioned at different heights or configurations, a single processing unit can handle both gas processing (with narrow gaps for contaminant suppression) and liquid processing (with wide gaps for smooth liquid flow), eliminating the need for separate dedicated units for each processing type.
Data Source
AI summary
A first holding plate and a second holding plate are provided. The first holding plate has a first flat plate portion facing a bottom surface of a substrate and holds the substrate so as to form a gap between the first flat plate portion and the substrate as a first gap, and the second holding plate has a second flat plate portion facing the bottom surface of the substrate and holds the substrate so as to form a gap between the second flat plate portion and the substrate as a second gap. Depending on a processing to be performed, any one of the first holding plate and the second holding plate is mounted on a rotational shaft of a shaft mechanism that includes a fluid supply unit configured to supply a fluid to the bottom surface of the substrate and the rotational shaft configured to rotate the substrate. The processing is performed on the substrate by supplying the fluid to the bottom surface of the substrate from the fluid supply unit.