Dual Housing Semiconductor Component with Embedded Inner Chip

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing semiconductor components face challenges in providing a robust and efficient electrical connection between semiconductor chips and external contact surfaces, particularly in protecting the chips from environmental factors while allowing for different contact surface arrangements and configurations.

Innovation Solution

The semiconductor component employs a dual housing structure with an inner semiconductor component housing embedded within an outer housing, utilizing a first and second plastic housing composition with distinct contact surface arrangements, and an electrically conductive redistribution structure, including leadframes, bonding wires, and contact clips, to establish connections between the inner and outer housing contact surfaces, adhering to JEDEC standards.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a single housing structure is used, then the device complexity is low, but the adaptability and versatility of contact surface arrangements are limited

Engineering Contradiction:

Improvecontact surface arrangement flexibilityVSAvoidhousing structure complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The housing is divided into an inner housing and an outer housing, each capable of having different contact surface arrangements. This segmentation allows the component to accommodate multiple contact patterns (e.g., different pin configurations, contact pad layouts) without requiring multiple complete housing designs, thus improving adaptability while managing complexity through modular separation.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The inner housing is nested within the outer housing, with the inner housing containing the semiconductor chip and first contact surfaces, while the outer housing provides additional contact surfaces and protective enclosure. This nesting arrangement enables multiple contact surface arrangements to coexist in a single component structure, enhancing versatility without proportionally increasing overall device complexity.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Object-affected harmful factors

If the semiconductor chip is exposed, then the ease of manufacture is high, but the protection from environmental factors is insufficient

Engineering Contradiction:

Improveenvironmental protectionVSAvoidmanufacturing process simplicity

Core Design Contradiction:

Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The semiconductor chip is enclosed within the inner housing, which itself is contained within the outer housing. This nested protective structure shields the chip from environmental factors such as moisture, dust, and mechanical damage while maintaining a compact form factor that does not significantly complicate the manufacturing process compared to single-housing designs.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The inner and outer housings act as intermediary protective layers between the semiconductor chip and the external environment. These housings provide physical barriers against harmful environmental factors while allowing electrical connections to pass through via the contact surfaces, thus protecting the chip without completely isolating it from necessary electrical interactions.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Adaptability or versatility

If multiple contact surface arrangements are provided in a single housing, then the adaptability is improved, but the manufacturing precision requirements increase

Engineering Contradiction:

Improvecontact surface configuration optionsVSAvoidcontact surface alignment precision

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

Different contact surface arrangements are implemented on separate housing segments (inner housing vs. outer housing) rather than attempting to integrate multiple arrangements on a single housing. This segmentation allows each housing to be manufactured with its own optimized contact surface precision requirements, reducing the overall manufacturing precision burden while maintaining high adaptability through the combination of different contact configurations on the two housings.

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS9991183B2Semiconductor component having inner and outer semiconductor component housings

Publication Date: 2018.06.05 INFINEON TECH AUSTRIA AG

AI summary

A semiconductor component includes an inner semiconductor component housing and an outer semiconductor component housing. The inner semiconductor component housing includes a semiconductor chip, a first plastic housing composition and first housing contact surfaces. At least side faces of the semiconductor chip are embedded in the first plastic housing composition and the first housing contact surfaces are free of the first plastic housing composition and include a first arrangement. The outer semiconductor component housing includes a second plastic housing composition and second housing contact surfaces which include a second arrangement. The inner semiconductor component housing is situated within the outer semiconductor component housing and is embedded in the second plastic housing composition. At least one of the first housing contact surfaces is electrically connected with at least one of the second housing contact surfaces.