Dual IC Transducer Redundancy for Fault Detection
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Solution Overview
Problem
Existing methods for increasing the reliability of transducers, such as sensors, lack redundancy and efficient fault detection, leading to potential failures and costly interventions in assemblies like those used in motor vehicles for temperature and angular displacement monitoring.
Innovation Solution
A method involving two integrated circuits (ICs) with monolithically integrated sensor components and controllable switches for bidirectional data transmission, where signals from both ICs are compared and analyzed in a control unit, allowing for redundancy and easy switching off of faulty ICs without replacing the entire package, utilizing a master/slave configuration and SENT protocol compliance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single IC is used in an IC package, then the device complexity is low, but the reliability is insufficient and fault detection is not possible
Solution Approach 1:
The patent divides the monitoring function into two separate ICs (first IC and second IC), each with its own sensor and signal processing capabilities. This segmentation allows independent operation and comparison of the two ICs, enabling fault detection while maintaining manageable complexity through modular design.
Solution Approach 2:
The patent combines two separate ICs into a single IC package, merging their functionality while maintaining physical integration. The package housing accommodates both ICs along with their respective circuit components, creating a unified assembly that provides redundancy without requiring separate discrete components.
2Reliability
If redundancy is added through multiple ICs, then the reliability increases, but the number of signal lines and device complexity increase
Solution Approach 1:
The signal contact in each IC is designed to serve multiple functions: it transmits the sensor signal, provides bidirectional communication for fault detection, and enables protocol-compliant data exchange. This multi-functionality reduces the need for separate dedicated lines for each purpose.
Solution Approach 2:
The patent uses identical IC designs for both the first IC and second IC, creating copies of the same functional unit. This allows the system to maintain the same number of signal line types while adding redundancy, as both ICs use the same contact configurations and signal protocols.
3Reliability
If faulty IC replacement is required, then the reliability can be restored, but the intervention cost and complexity increase
Solution Approach 1:
The system enables self-diagnosis through the controllable switches and signal comparison mechanisms. The control unit can identify which IC is faulty by comparing signals and monitoring switch states, allowing for targeted replacement of only the defective IC rather than replacing the entire package, thereby reducing intervention complexity and cost.
4Ease of operation
If separate supply voltage lines are used for each IC, then the ability to switch off faulty ICs improves, but the device complexity increases
Solution Approach 1:
The patent implements dynamic control of the supply voltage lines through controllable switches. The switches can be opened or closed based on operational requirements, allowing the control unit to dynamically enable or disable power to specific ICs for fault isolation or normal operation, providing operational flexibility without requiring permanently separate power lines.
Data Source
AI summary
A method for increasing a reliability of a transducer is provided. The transducer has a first and a second IC, wherein the two ICs each have substantially the same monolithically integrated circuit components with one sensor apiece, and a signal contact for bidirectional data transmission. A reference contact on each of the two ICs is connected to or disconnected from the signal contact by a controllable switch, and a signal generated as a function of the physical quantity sensed by the relevant sensor is applied to the signal contact. The two ICs are integrated into a common IC package, and a supply voltage contact of the first IC is connected to a first package contact, and the first package contact is connected to a first terminal of a control unit, and the supply voltage contact of the second IC is connected to a second package contact.