Dual-Impeller Pump Mechanism for Multi-Source Heat Dissipation
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Solution Overview
Problem
Conventional pump mechanisms for electronic devices with multiple heat sources require multiple pumps, leading to complex connections and difficulty in miniaturization, making effective heat dissipation inefficient.
Innovation Solution
A pump mechanism with two driving modules and impellers, featuring a housing with recesses, channels, and output pipes, allowing liquid to flow through and be driven by the impellers for efficient heat dissipation, connected to electronic components for enhanced cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If multiple pumps are used to cool multiple heat sources, then heat dissipation effectiveness is improved, but device complexity and connection difficulty increase
Solution Approach 1:
The patent combines multiple pump functions into a single integrated pump body with multiple pump chambers (first, second, third pump chambers). Each chamber has its own impeller driven by a common drive shaft, allowing multiple liquid flows to be generated from one unified structure. This merging approach maintains effective heat dissipation for multiple heat sources while eliminating the need for multiple separate pumps and their complex interconnections.
Solution Approach 2:
The single pump body performs multiple cooling functions simultaneously through its multiple pump chambers. The first pump chamber cools the first heat source, the second pump chamber cools the second heat source, and the third pump chamber provides additional cooling capacity. This multi-functional design allows one pump to replace what would traditionally require multiple separate pumps, simplifying the overall system architecture.
2Temperature
If multiple pumps are used for multiple heat sources, then cooling coverage is improved, but miniaturization becomes difficult
Solution Approach 1:
The pump design features nested pump chambers where the second pump chamber is positioned within or adjacent to the first pump chamber, and the third pump chamber is integrated into the same pump body structure. The impellers are arranged concentrically or in close proximity, sharing common structural elements and the drive shaft. This nesting arrangement provides extensive cooling coverage for multiple heat sources while maintaining a compact overall pump volume that enables miniaturization.
3Device complexity
If a single pump is used, then device complexity is reduced, but heat dissipation effectiveness for multiple sources decreases
Solution Approach 1:
The single pump body is segmented into multiple independent pump chambers (first, second, and third pump chambers), each capable of independently pumping liquid to different heat sources. Each chamber has its own impeller that can be independently controlled via the drive shaft. This segmentation allows the single pump to effectively dissipate heat from multiple sources by directing liquid flow to different locations, maintaining heat dissipation effectiveness while preserving structural simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The pump mechanism effectively dissipates heat from multiple electronic components by using dual impellers and driving modules, improving cooling efficiency and miniaturization potential.
Implementation Method 1
two driving modules respectively driving the first impeller and the second impeller to rotate, and the liquid in the first recess and the second recess can respectively leave the pump mechanism
Data Source
AI summary
A pump mechanism is provided, including a housing, a first impeller, a second impeller, and two driving modules. The housing includes a first recess, a second recess, a plate, a channel, an input pipe, a first output pipe, and a second output pipe. The plate is disposed between the first recess and the second recess. The channel passes through the plate and communicated with the first recess and the second recess. The input pipe is connected to the channel and passes through the housing and the plate. The first output pipe and the second output pipe are respectively communicated with the first recess and the second recess.