Dual Index Head Bonding for Faster Thermocompression Cycles
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing thermocompression and indexing apparatuses in semiconductor production are limited by sequential performance of thermocompression and indexing steps, which can reduce output speed without affecting product quality.
Innovation Solution
Simultaneous implementation of bonding and indexing processes using two indexing heads that move in opposite directions to balance movements, allowing for reduced cycle times and increased output.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If thermocompression and indexing are performed sequentially, then product quality is maintained, but output speed is reduced
Solution Approach 1:
The patent combines thermocompression bonding and indexing operations into a single integrated head that performs both functions simultaneously. The thermocompression shoe and indexing shoe are merged into one unit that can apply bonding pressure and heat while also advancing the substrate through indexing motion, eliminating the need for sequential operation and reducing cycle time.
Solution Approach 2:
The indexing head is designed with multi-functionality to perform both thermocompression bonding and substrate indexing within a single operational cycle. The head includes both a thermocompression shoe for applying heat and pressure, and an indexing shoe for advancing the substrate, allowing one component to execute multiple process steps without requiring separate dedicated devices.
2Loss of time
If two indexing heads are used for simultaneous bonding and indexing, then cycle time is reduced, but device complexity increases
Solution Approach 1:
Rather than using two separate indexing heads operating in parallel, the patent merges the thermocompression and indexing functions into a single integrated head. This consolidation reduces device complexity by eliminating redundant components while still achieving simultaneous bonding and indexing through coordinated motion of the unified head assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances apparatus output by reducing cycle time without compromising product quality through synchronized thermocompression and indexing operations.
Implementation Method 1
In some arrangements compressive force is applied to the substrate at a defined temperature, such as, for example, in thermocompression bonding.
Implementation Method 2
Heat is applied to the element and to the substrate by the thermocompression head.
Implementation Method 3
compressive force is applied to the substrate at a defined temperature
Data Source
AI summary
A bonding and indexing method is provided, having a first index head to move a substrate in an indexing direction from a first position to a second position; a second index head to move the substrate in an indexing direction from the second position to a third position; and the first and/or second index head has a bonding element to effect a bonding process between the substrate and an element disposed against the substrate so that bonding and movement in the indexing direction is implemented simultaneously by the first index head and/or bonding and movement in the indexing direction is implemented simultaneously by the second index head.