Dual Inductance Structure for Reducing Mutual Inductance
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Solution Overview
Problem
Existing miniaturized bandpass filters face challenges in reducing size while maintaining mutual and self-inductance values, leading to increased circuit layout area and occupied space in electronic devices.
Innovation Solution
A dual inductance structure comprising a substrate with interconnected first and second inductance elements and a grounding element, where the grounding element separates the inductance elements to minimize mutual inductance, allowing for reduction in conductor lengths and area without increasing distance, thereby reducing the overall size of the electronic device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the distance between conductors is increased to reduce mutual inductance, then mutual inductance value is reduced, but circuit layout area is increased
Solution Approach 1:
A grounding element is introduced as an intermediary between the first and second inductance elements. This grounding element acts as a mediator to control and reduce the mutual inductance between the two inductors without requiring increased separation distance, thereby maintaining compact circuit layout while achieving desired mutual inductance reduction
Solution Approach 2:
The grounding element changes the electromagnetic field distribution and coupling parameters between the conductors. By introducing this intermediate grounding structure, the mutual inductance parameter is modified without changing the physical distance between inductance elements, thus reducing mutual inductance while maintaining compact area
2Area of stationary object
If conductor length is reduced to minimize area, then layout area is reduced, but maintaining self-inductance value becomes difficult
Solution Approach 1:
The inductance elements utilize three-dimensional spatial arrangement with grounding elements positioned at different vertical layers (first grounding portion between first and third conductors, second grounding portion between second and fourth conductors). This dimensional approach allows maintaining self-inductance values with shorter conductors by utilizing vertical space for electromagnetic field confinement
3Reliability
If multiple grounding portions are added to control mutual inductance, then mutual inductance is reduced, but device complexity is increased
Solution Approach 1:
Multiple grounding portions are merged into a single integrated grounding element structure. The first grounding portion and second grounding portion are combined in one grounding element, simplifying the overall device structure while maintaining the mutual inductance reduction effect. This unified approach avoids the complexity of separate grounding structures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The dual inductance structure effectively reduces the mutual inductance value by shortening conductor lengths, minimizing the circuit layout area and enhancing the compactness and portability of electronic devices while maintaining self-inductance values.
Implementation Method 1
The inductance L1 and the inductance L2 have the effect of mutual inductance. As we may know that the smaller the distance W1 is separated the larger the mutual inductance is induced
Implementation Method 2
the conductor 102 can be equivalent to an inductance L1, and the conductor 104 can be equivalent to an inductance L2
Data Source
AI summary
A dual inductance structure including a substrate, a first inductance element, a second inductance element and a grounding element is provided. The substrate has a layout layer and a grounding layer. The first inductance element has a first and a second conductor. The second inductance element has a third and a fourth conductor. The grounding element has a first and a second grounding portion. The first grounding portion is on the grounding layer and located at an area between the first conductor and the third conductor. At least a part of the second grounding portion is on the grounding layer and located at an area between the first conductor and the second conductor. At least another part of the second grounding portion is on the grounding layer and located at an area between the third conductor and the fourth conductor.