Dual-Input Power Supply Layout With Shared DC/DC Stage
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Solution Overview
Problem
Existing dual-input power supplies for data centers require redundant components and human intervention for quick replacement, leading to increased costs, space requirements, and potential disruptions due to the limited lifespan of ac-dc power supply components like fans and electrolytic capacitors.
Innovation Solution
A dual-input power supply design that shares certain components, such as a dc/dc converter, between two power paths, allowing for continuous operation even if one power source fails, eliminating the need for an automatic transfer switch and reducing the number of required components and space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If redundant power supplies are used to ensure continuous operation, then reliability is improved, but device complexity and cost increase
Solution Approach 1:
The patent merges two power supply systems by sharing the second stage (DC/DC converter and output capacitor) between two input paths. Each input path has its own first stage (rectifier and PFC circuit), but both stages feed into a common second stage. This combining approach maintains reliability through redundancy while reducing overall system complexity and component count compared to having completely separate power supplies.
2Reliability
If redundant power supplies are used to ensure continuous operation, then reliability is improved, but space requirements increase
Solution Approach 1:
By combining the second stage components (DC/DC converter and output capacitor) into a shared resource between two input paths, the patent significantly reduces the space required compared to having two complete redundant power supply systems. The shared second stage eliminates duplicate components, thereby reducing the overall footprint while maintaining the ability to continue operation if one input path fails.
3Reliability
If complete redundancy with separate power supplies is used, then reliability is improved, but manufacturing cost increases
Solution Approach 1:
The patent reduces manufacturing cost by merging the second stage components into a shared resource between two input paths. This approach eliminates the need to manufacture and install two complete sets of DC/DC converters and output capacitors, thereby reducing material costs, assembly costs, and overall manufacturing complexity while still providing redundancy through separate first stages.
4Ease of operation
If an automatic transfer switch is used for quick replacement, then ease of operation is improved, but device complexity increases
Solution Approach 1:
The patent implements preliminary action by designing the power supply system with hot-swappable first stage modules that can be quickly replaced without powering down the system. The modular design with standardized connectors and interfaces allows operators to perform maintenance and replacements rapidly. This preliminary design consideration eliminates the need for complex automatic transfer switches while maintaining ease of operation through simplified manual hot-swapping capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures continuous power supply to data center loads without the need for an automatic transfer switch, reducing costs, space requirements, and the risk of power disruptions, while extending the lifespan of critical components.
Implementation Method 1
power-factor correction circuits
Implementation Method 2
power-factor correction circuits
Implementation Method 3
dc/dc converter
Data Source
AI summary
A dual-input power supply has two power paths that connect a server to electrical Each power path has a first stage that comprises a power-factor correction circuit. The power paths share a common second stage that comprises a dc/dc converter. The first stages of the power paths collectively defining a pair of first stages that is disposed either within a package that is off the motherboard or without a package and on the motherboard. Similarly, the second stage is disposed either within a package that is off the motherboard or without a package and on the motherboard.


