Dual Insulating Layer Packaging for Compact Electronic Interconnects
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Solution Overview
Problem
Current electronic device packaging methods face challenges with small components, including insufficient space, frequent disconnection, short-circuiting, and current leakage, due to the limitations of directly applying protective layers on compact electronic units.
Innovation Solution
The implementation of a dual insulating layer structure, where a first insulating layer is applied on the electronic unit's surface and a second insulating layer is stacked on top, with a connecting element electrically connected to the unit, to enhance protection and reliability while addressing space constraints.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a protective layer is directly disposed on a small electronic unit, then the electronic unit gains protection against pollutants and damage, but the device experiences insufficient space in circuit design, frequent unintended disconnection, short-circuiting, and current leakage
Solution Approach 1:
The protective layer is divided into multiple insulating layers (first insulating layer, second insulating layer, third insulating layer) with different functions and thicknesses. Each layer segments the protection task: the first layer provides base protection, the second layer adds intermediate protection with connecting elements, and the third layer provides final protection. This segmentation allows adequate protection while managing space constraints through functional distribution.
Solution Approach 2:
The patent transitions from a single-layer protective structure to a multi-layer stacked structure in the vertical dimension. By adding layers in the thickness direction rather than expanding laterally, the patent achieves enhanced protection and electrical isolation without significantly increasing the planar footprint, thus addressing space constraints while improving reliability.
2Volume of moving object
If the size of electronic units and components is reduced to meet consumer demand, then the electronic device becomes more compact, but the device experiences insufficient space, frequent disconnection, short-circuiting, and current leakage
Solution Approach 1:
Different insulating layers are applied with different local properties: the first insulating layer covers the entire second surface for base protection, the second insulating layer is disposed on specific regions where connecting elements are needed, and the third insulating layer provides additional protection in critical areas. This local quality approach ensures adequate insulation and connection reliability even in compact designs.
Solution Approach 2:
The patent uses multiple insulating layers made of different materials or with different properties stacked together. This composite structure provides combined benefits: electrical insulation, mechanical protection, and controlled electrical connection through the connecting elements, all within a compact form factor that maintains reliability.
Data Source
AI summary
An electronic device and a manufacturing method thereof are provided. The electronic device includes an electronic unit, a first insulating layer, a second insulating layer and a connecting element. The electronic unit includes a first surface, a second surface opposite to the first surface, and a first side surface connecting the first surface to the second surface. The first insulating layer is disposed on the second surface. The second insulating layer is disposed on the first insulating layer. The second insulating layer includes a third surface, a fourth surface opposite to the third surface, and a second side surface connecting the third surface to the fourth surface. The connecting element is disposed on the second insulating layer and is electrically connected to the electronic unit. The third surface of the second insulating layer is in contact with the second surface of the electronic unit.