Dual Insulating Spacer PCB for High Voltage Lead Isolation
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Solution Overview
Problem
As electronic devices shrink, ensuring sufficient insulation distances between leads on printed circuit boards becomes challenging, particularly for components with high rated voltages, as traditional methods like bending leads are not feasible in reduced spaces.
Innovation Solution
The use of a dual insulating spacer system, where a first spacer isolates leads on the printed circuit board's front surface and a second spacer engages from the back surface to create insulation distances, combined with insulating resin to seal gaps and enhance reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If electronic devices are reduced in size, then device compactness is improved, but insulation distance between leads deteriorates
Solution Approach 1:
The invention transitions from two-dimensional lead routing on the PCB surface to three-dimensional insulation by adding vertical separation. Insulating spacers are positioned between leads and engaged from both front and back surfaces of the PCB, creating vertical insulation barriers that extend through the PCB thickness. This multi-dimensional approach allows sufficient insulation distance to be achieved within a compact device footprint.
Solution Approach 2:
Insulating spacers serve as intermediary elements between adjacent leads. These spacers are inserted into grooves formed in the PCB and engaged from both front and back surfaces, physically separating the leads and maintaining required insulation distances. The spacers act as mediators that enable compact lead spacing while preserving electrical insulation.
2Reliability
If insulating spacers are added to ensure insulation distance, then insulation reliability is improved, but device complexity increases
Solution Approach 1:
The invention merges the insulating spacer structure with the PCB groove features. Spacers are inserted into grooves that are integral to the PCB structure, combining the spacer function with the mounting structure. This integration reduces the number of separate components and simplifies assembly compared to using discrete insulating elements.
Solution Approach 2:
The insulation system is segmented into multiple functional parts: front surface spacers, back surface spacers, and groove structures. This segmentation allows each component to be optimized for its specific function and enables modular assembly. The divided approach simplifies manufacturing and assembly while achieving comprehensive insulation coverage.
Data Source
AI summary
An electronic device includes an electronic component provided with leads. A printed circuit board has a front surface and a back surface and is provided with through holes and a groove hole. The through holes are capable of receiving the leads, respectively. The groove hole is formed so as to cross straight lines that connect the through holes. A first insulating spacer is provided on the groove hole between the leads so as to isolate the leads from each other and is positioned between the electronic component and the front surface of the printed circuit board. A second insulating spacer is inserted through the groove hole from the back surface of the printed circuit board and engages with the first insulating spacer so as to isolate end portions of the leads from each other.