Dual-Interface IC Card Contact Structure Cost Reduction

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Solution Overview

Problem

Dual-interface IC cards are more expensive to manufacture due to the inclusion of both electrical contacts and antennas, necessitating a cost-effective manufacturing method for these components.

Innovation Solution

The use of a single-sided contact base structure with attached antenna contact leads forms a dual-interface contact structure, which is more cost-effective than traditional prefabricated dual-interface contact tapes, utilizing a substrate with an electrical contact layer and adhesive material to attach antenna contact leads, reducing manufacturing costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If dual-interface IC cards include both electrical contacts and antennas, then communication versatility is improved, but manufacturing cost increases

Engineering Contradiction:

Improvecommunication versatilityVSAvoidmanufacturing cost

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent divides the dual-interface contact structure into separate functional components: a single-sided contact base structure and antenna contact leads. This segmentation allows each component to be manufactured independently using optimized processes, reducing overall manufacturing complexity and cost while maintaining both contact and antenna functionality.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent combines the single-sided contact base structure with antenna contact leads to form an integrated dual-interface contact structure. This merging enables both contactless and contact communication capabilities within a single component, achieving versatility without requiring separate assemblies.

Inventive Principle:

Principle #5Merging (Combining)

2Productivity

If prefabricated dual-interface contact tapes are used, then manufacturing speed is improved, but manufacturing cost increases

Engineering Contradiction:

Improvemanufacturing speedVSAvoidmanufacturing cost

Core Design Contradiction:

ProductivityVSEase of manufacture

Solution Approach 1:

The patent prepares the single-sided contact base structure and antenna contact leads as separate pre-fabricated components with appropriate contact surfaces and geometries. These pre-prepared components can be quickly assembled together, maintaining high manufacturing speed while avoiding the high cost of pre-fabricated dual-interface contact tapes.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent employs cost-effective materials and manufacturing methods for the single-sided contact base structure and antenna contact leads, using economical alternatives to expensive prefabricated dual-interface contact tapes. This approach achieves acceptable performance at lower cost.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

3Manufacturing precision

If etching or stamping technology is used for dual-interface contact tapes, then manufacturing precision is improved, but manufacturing cost increases

Engineering Contradiction:

Improvecontact alignment precisionVSAvoidmanufacturing cost

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

By segmenting the dual-interface structure into separate components manufactured by different methods, the patent avoids applying expensive etching or stamping technology to the entire assembly. Instead, these precision techniques are used only where necessary for individual components, reducing overall manufacturing cost while maintaining required precision.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly lowers the manufacturing cost of dual-interface IC cards by using prefabricated single-sided contact base structures and adhesive attachment of antenna contact leads, compared to conventional methods relying on expensive double-sided contact tapes.

Implementation Method 1

utilizing a substrate with an electrical contact layer and adhesive material to attach antenna contact leads

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentEP3079105B1Dual-interface IC card components and method for manufacturing the dual-interface IC card components

Publication Date: 2021.03.31 NXP BV

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AI summary

Dual-interface Integrated Circuit (IC) card components and methods for manufacturing the dual-interface IC card components are described. In an embodiment, a dual-interface IC card component includes a single-sided contact base structure, which includes a substrate with an electrical contact layer. On the single-sided contact base structure, one or more antenna contact leads are attached to the single-sided contact base structure to form a dual-interface contact structure, which is a component of a dual-interface IC card. Other embodiments are also described.