Dual-Interface IC Card Single-Sided Substrate Antenna Integration
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Solution Overview
Problem
Dual-interface IC cards are more expensive to manufacture due to the need for both electrical contacts and antennas, and existing manufacturing methods do not effectively address mechanical reliability and cost-effectiveness.
Innovation Solution
A dual-interface IC card design utilizing a single-sided substrate with antenna connectors that eliminate the need for etched contacts on the back side, allowing for longer bond wires and improved mechanical reliability, and using solder or conductive adhesive for connections, reducing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a prefabricated double-sided contact base structure is used to provide contact pads on both sides of the substrate, then the dual-interface IC card can be manufactured with both contact and contactless functionality, but the manufacturing cost increases due to the complexity of the substrate structure and the need for etched contacts on the back side
Solution Approach 1:
The invention extracts the antenna contacts from the back side of the substrate and relocates them to the front side, eliminating the need for a double-sided contact base structure. This allows the use of simpler single-sided substrates, reducing manufacturing complexity and cost while maintaining dual-interface functionality.
Solution Approach 2:
The invention changes the spatial arrangement of contacts from a two-sided distribution to a one-sided concentration. By placing both contact and antenna contacts on the front side of the substrate, the design eliminates the need for back-side etching and complex double-sided structuring, thereby reducing manufacturing costs.
2Stability of the object's composition
If the depth between the integrated circuit and the routing connection is limited, then the substrate structure remains compact, but the bond wires become shorter and more susceptible to breakage when the card is subjected to bending
Solution Approach 1:
The invention utilizes the vertical dimension (depth) of the substrate by positioning the antenna contacts at a greater distance from the integrated circuit in the vertical direction. This allows longer bond wires to be used, improving reliability under mechanical stress while maintaining a compact overall structure.
3Length of stationary object
If bond wires connecting the routing connections to the IC are covered by a thinner encapsulation layer, then the overall card thickness is reduced, but the mechanical reliability and protection of the bond wires are compromised
Solution Approach 1:
The invention applies a thicker encapsulation layer specifically in the region where the bond wires are located, providing enhanced protection and mechanical reliability. This localized thickening does not significantly increase the overall card thickness, as the additional encapsulation is confined to the specific area needing protection.
Data Source
AI summary
The disclosure relates to a dual-interface integrated circuit (IC) card. Embodiments disclosed include a dual-interface card (100) comprising: a card body (122) containing an antenna (120), the antenna having first and second antenna connections; and a dual-interface integrated circuit card module (150) comprising: a substrate (104) having first and second opposing surfaces; a contact area (102) on the first surface of the substrate (104), the contact area (102) comprising a plurality of contact pads (108) and first and second routing connections (106) each having a first end and a second end; an integrated circuit (110) on the second surface of the substrate (104); electrical connections through the substrate (104) connecting the integrated circuit (110) to the plurality of contact pads (108) and to the first end of each of the first and second routing connections (106); and first and second antenna connectors (118) disposed in respective first and second holes (103) in the substrate (104) and in electrical contact with the second end of the respective first and second routing connections, wherein the first and second antenna connectors (118) of the card module are electrically connected to the first and second antenna connections of the card body (122).