Dual-Interposer IC Package for Lower Thermal Resistance

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Solution Overview

Problem

The challenge in semiconductor packaging is to integrate multiple semiconductor dies efficiently while reducing thermal resistance and improving circuit design flexibility without relying on back-side interconnect structures.

Innovation Solution

The integration of a first interposer in physical and electrical contact with the backside interconnect structures of integrated circuit dies and a second interposer coupled with the front-side interconnect structures, allowing for hybrid bonding that reduces thermal resistance and enhances design flexibility.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional packaging techniques are used, then manufacturing simplicity is maintained, but thermal resistance increases and design flexibility is reduced

Engineering Contradiction:

Improvethermal resistanceVSAvoidpackaging structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent introduces interposers as intermediary components between semiconductor dies to achieve thermal management and electrical interconnection. The first interposer is bonded to the backside of the semiconductor die, serving as a mediator that reduces thermal resistance by providing a thermal pathway, while the second interposer enables front-side electrical coupling, thereby resolving the contradiction between improving thermal performance and maintaining packaging simplicity.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Adaptability or versatility

If back-side interconnect structures are used, then electrical coupling is achieved, but design flexibility is limited

Engineering Contradiction:

Improvecircuit design flexibilityVSAvoidinterconnect structure

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent segments the interconnection function into two separate interposers: the first interposer handles backside bonding and thermal management, while the second interposer handles front-side electrical coupling. This segmentation allows each interposer to be optimized for its specific function, thereby increasing circuit design flexibility without requiring a single complex back-side interconnect structure.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent transitions from traditional back-side only interconnection to a multi-dimensional approach by introducing front-side electrical coupling through the second interposer. This adds a new dimension (front-side connectivity) to the interconnection architecture, enabling more flexible circuit designs that were not possible with conventional back-side interconnect structures alone.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS12546935B2Integrated circuit package and method of forming same

Publication Date: 2026.02.10 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A package includes an encapsulant having a first side and a second side opposite to the first side, a first integrated circuit die and a second integrated circuit die embedded in the encapsulant, and a first interposer on the first side of the encapsulant. The first interposer is mechanically and electrically coupled to the first integrated circuit die and the second integrated circuit die. The package further includes a second interposer on the second side of the encapsulant. The second interposer is mechanically and electrically coupled to the first integrated circuit die and the second integrated circuit die. The second interposer optically or electrically couples the first integrated circuit die to the second integrated circuit die.