Dual Laminate Package With Embedded Interposer
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Solution Overview
Problem
Existing semiconductor package designs fail to maximize space efficiency on printed circuit boards due to limitations in form factor and mounting density, particularly when stacking packages, as current solutions like straddle mount laminate BGA or stacked die TSOP do not meet the required standards.
Innovation Solution
A semiconductor package architecture that incorporates a prefabricated embedded interposer allowing two complimentary laminate substrate elements to be joined, enabling topside routing and embedding of multiple components, with the interposer mounted to both substrates via a standard ball grid array interconnect and encapsulated in a mold compound to secure its position.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If semiconductor packages are stacked to maximize space efficiency, then the number of packages per unit area increases, but existing stacking solutions (straddle mount laminate BGA, stacked die TSOP) fail to meet form factor requirements
Solution Approach 1:
The patent embeds an interposer structure within the laminate substrate, creating a nested configuration where the interposer is integrated into the substrate layers. This nested design enables vertical stacking of semiconductor packages while maintaining compatibility with standard PCB form factors, resolving the contradiction between increased package density and form factor requirements
Solution Approach 2:
The patent transitions from traditional planar package mounting to a three-dimensional stacked architecture by introducing vertical interconnection through the embedded interposer. This dimensional change allows multiple packages to be stacked vertically, dramatically increasing the number of packages per unit area while preserving standard PCB footprint dimensions
2Quantity of substance
If a prefabricated embedded interposer is used to enable stacking, then space efficiency and integration increase, but the device structure becomes more complex
Solution Approach 1:
The interposer is prefabricated and embedded into the laminate substrate during the substrate manufacturing process, before semiconductor packages are mounted. This preliminary action integrates the interconnection structure into the substrate itself, reducing the need for additional assembly steps and minimizing the overall structural complexity despite the advanced functionality
Solution Approach 2:
The embedded interposer serves multiple functions: providing electrical interconnection between stacked packages, enabling mechanical support for vertical stacking, and facilitating signal routing between different package layers. This multi-functionality reduces the need for separate dedicated structures, thereby managing device complexity while achieving high integration density
Data Source
AI summary
An interconnect structure (i.e., an interposer) which is mounted and electrically connected to a bottom semiconductor package substrate either prior or subsequent to such bottom substrate being populate with one or more electronic components. Subsequently, a top semiconductor package substrate which may also be populated with one or more electronic components is mounted to the interposer, such that all of the electronic components are disposed between the top and bottom interposers. Thereafter, a suitable mold compound is injected between the top and bottom substrates, the mold compound flowing about the electronic components, between the BGA joints, and at least partially about the interposer, thus helping to lock the interposer in place in the completed semiconductor package.