Dual Laser Optic Module With Co-Focus Overlap for Probe Pin Bonding
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Solution Overview
Problem
Conventional turntable-type probe pin laser bonding apparatuses face challenges in precisely controlling the power and density of laser beams due to separately arranged first and second laser optic modules with different focal points, leading to increased defect rates and limitations in miniaturization and precision.
Innovation Solution
An integrated dual laser optic module is developed, where the first and second laser beams are overlappingly irradiated on a co-focus, allowing precise control of power and density, and incorporating a laser filter unit and diffractive optical elements to achieve co-focal overlap.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the first and second laser optic modules are completely separated and arranged independently with different focal points, then the structural complexity is reduced and ease of manufacture is improved, but the manufacturing precision and bonding defect rate worsen
Solution Approach 1:
The patent merges the first and second laser optic modules into a single integrated dual laser optic module. The module includes a first laser beam incident in a first direction, a second laser beam incident in a second direction orthogonal to the first direction, and a laser filter unit that overlaps these beams to achieve co-focus, thereby improving manufacturing precision while maintaining ease of manufacture through modular integration.
2Device complexity
If the first and second laser optic modules are completely separated and arranged independently with different focal points, then the device complexity is reduced, but the manufacturing precision and power control capability worsen
Solution Approach 1:
The patent integrates two laser optic modules into one unified structure with shared optical components. The body unit contains both the first laser connection unit and second laser connection unit, along with the laser filter unit that processes both beams, reducing device complexity while achieving co-focus for high precision.
Solution Approach 2:
The patent uses orthogonal incident directions for the first and second laser beams (first direction and second direction orthogonal to the first direction), then overlaps them in the third direction through the laser filter unit to achieve co-focus, utilizing dimensional transformation to resolve the contradiction.
3Device complexity
If conventional separate laser optic modules are used with different focal points, then the apparatus structure is simpler, but the precision and power control for miniaturized probe pins deteriorates
Solution Approach 1:
The patent combines first and second laser optic modules into an integrated dual laser optic module with co-focused beams, enabling precise power and density control for miniaturized probe pins while maintaining reasonable device complexity through shared optical components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly reduces the bonding defect rate and enhances the integration and precision of the apparatus by eliminating spatial restrictions, enabling precise control over the laser beams for miniaturized probe pins.
Implementation Method 1
a laser filter unit equipped inside the body part and overlapping the first laser beam and the second laser beam that meet inside the body part to have a co-focus by being transmitted or reflected, respectively
Implementation Method 2
Any one of the first and second laser connection units is further equipped with a diffractive optical element (DOE) lens therein
Data Source
AI summary
The present invention relates to a turntable-type probe pin laser bonding apparatus. More particularly, a dual laser optic module of the turntable-type probe pin bonding apparatus of the present invention provides an integrated dual laser optic module that is overlappingly irradiated on a co-focus by improving the conventional first and second laser optic modules that have been completely separated and arranged independently with different focal points. During laser bonding of probe pins, which are getting miniaturized day by day, the power and density of the first and second laser beams overlappingly irradiated from the integrated dual laser optic module can be precisely controlled so that a turntable-type probe pin laser bonding apparatus of the present invention can significantly improve the bonding defect rate, as well as contribute to high integration and high precision of the apparatus.