Dual Laser Beam System for Electron Microscope Debris Isolation
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Solution Overview
Problem
Current systems cannot perform multiple laser processing tasks simultaneously without producing large amounts of debris, which interferes with SEM/STEM/TEM and FIB operations, and require separate systems for different laser types, leading to inefficient processing and potential damage to samples.
Innovation Solution
A system utilizing two focused laser beam spots, one for bulk material removal and deep trench etching externally and another for precision work internally, within a vacuum chamber, allowing for simultaneous or sequential processing without contaminating the chamber with debris.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If bulk material removal is performed using laser ablation, then processing speed is improved, but large amounts of debris are generated that interfere with SEM/STEM/TEM and FIB operations
Solution Approach 1:
The patent divides the laser processing into two separate stations: an external laser processing station for bulk material removal and an internal laser processing station for precision work. This segmentation allows debris-generating operations to be isolated from the sensitive imaging chamber, resolving the contradiction between high-speed processing and debris generation.
Solution Approach 2:
The patent extracts the bulk material removal function from the imaging chamber by performing it at an external laser processing station. This removes the harmful debris-generating operation from the environment where it would interfere with SEM/STEM/TEM and FIB operations.
2Adaptability or versatility
If separate systems are used for bulk material removal and precision machining, then processing capabilities are improved, but system complexity increases
Solution Approach 1:
The patent combines bulk material removal and precision machining capabilities into a single integrated system with two laser processing stations. This allows the system to perform multiple functions without requiring completely separate systems, reducing overall complexity while maintaining versatility.
Solution Approach 2:
The patent creates a universal system that can perform both bulk material removal and precision machining functions. The dual-station laser system provides multi-functionality, allowing a single system to handle diverse processing requirements that would otherwise need separate specialized systems.
3Productivity
If high beam currents are used for FIB micromachining, then material removal rate is improved, but damage to nanometer-scale layers occurs
Solution Approach 1:
The patent segments the micromachining process into two stages: bulk material removal using high beam current FIB followed by precision work on nanometer-scale layers using low beam current FIB or laser. This segmentation allows high productivity operations to be separated from precision operations, preventing damage to sensitive layers.
Solution Approach 2:
The patent performs preliminary bulk material removal using high beam current FIB before proceeding to precision work on nanometer-scale layers. This preliminary action removes the bulk material that would otherwise require lengthy precision processing, enabling subsequent delicate operations to be performed with appropriate low beam currents without damaging sensitive structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient bulk material removal and precision machining in a single system, reducing debris contamination and extending the longevity of SEM/STEM/TEM and FIB components by segregating processing stages, thus improving processing capabilities and system longevity.
Implementation Method 1
the first laser beam spot is used to remove bulk material from a workpiece
Implementation Method 2
the second laser beam spot is used for deep trench etching
Implementation Method 3
FIB systems use a finely focused beam of ions (usually gallium) that can be operated at low beam currents for imaging or high beam currents for site specific imaging, deposition, or milling
Implementation Method 4
The electron microscope, typically a scanning electron microscope (SEM), provides high-resolution image with minimal damage to the target
Data Source
AI summary
The present invention discloses an electron microscope and FIB system for processing and imaging of a variety of materials using two separate laser beams of different characteristics. The first laser beam is used for large bulk material removal and deep trench etching of a workpiece. The second laser beam is used for finer precision work, such as micromachining of the workpiece, small spot processing, or the production of small heat affected zones. The first laser beam and the second laser beam can come from the same laser source or come from separate laser sources. Having one laser source has the additional benefits of making the system cheaper and being able to create separate external and internal station such that the debris generated from bulk material removal from the first laser beam will not interfere with vacuum or components inside the particle beam chamber.