Dual-Laser Via Formation for Low Overhang Component Carriers
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Solution Overview
Problem
The increasing miniaturization of component carriers with electronic components poses challenges in efficiently removing heat generated by components and ensuring mechanical robustness and electrical reliability, particularly in forming high-quality laser holes with minimal overhang for effective conductive material filling.
Innovation Solution
A method involving the use of two laser beams with different sizes to create a window in the conductive layer structure, where the first laser beam forms a large window and the second, smaller beam removes material from the insulating layer structure below, promoting horizontal heat transfer and minimizing overhang, allowing for efficient filling with conductive material like copper.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a single laser beam is used to remove material from the insulating layer structure, then the process is simple, but the copper overhang is large (greater than 10 μm) which reduces filling quality
Solution Approach 1:
The laser beam is divided into two distinct beams: a first laser beam with larger diameter for removing material from the insulating layer structure, and a second laser beam with smaller diameter for removing material from the conductive layer structure. This segmentation allows each beam to be optimized for its specific function, resulting in reduced copper overhang (≤10 μm) while maintaining process simplicity.
Solution Approach 2:
Different regions of the component carrier receive different laser treatment: the insulating layer structure is processed by the first laser beam to create a wider removal zone, while the conductive layer structure is processed by the second laser beam for precise opening. This local differentiation of processing quality achieves minimal overhang without requiring complex overall system design.
2Productivity
If miniaturization of component carriers is pursued, then integration density increases, but heat removal becomes more difficult and mechanical robustness decreases
Solution Approach 1:
The patent addresses heat removal in miniaturized component carriers by creating precisely controlled three-dimensional structures through dual-laser processing. The differentiated laser beams enable accurate formation of conductive pathways and heat dissipation structures that extend into the depth of the component carrier, providing thermal management solutions in the vertical dimension while maintaining small footprint.
3Ease of manufacture
If the first laser beam removes more material from the insulating layer structure, then the window opening is larger, but the copper overhang increases
Solution Approach 1:
The patent extracts the material removal function into two separate laser beams with different characteristics. The first laser beam extracts material from the insulating layer structure to create a larger window opening, while the second laser beam extracts material from the conductive layer structure to define the final opening size. This extraction of functions prevents copper overhang while maintaining ease of manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a component carrier with a low copper overhang of less than 10 μm, enhancing the reliability and quality of via connections while maintaining high process stability and avoiding additional hardware or processing resources.
Implementation Method 1
removing material of the electrically insulating layer structure below the window by a first laser beam
Implementation Method 2
removing further material of the electrically insulating layer structure below the window by a second laser beam having a smaller size than the window
Implementation Method 3
laser beam which is configured for promoting heat transfer in the electrically conductive layer structure in horizontal direction and is configured for inhibiting heat transfer in vertical direction
Data Source
AI summary
A method includes providing an electrically conductive layer structure on top of an electrically insulating layer structure, forming a window in the electrically conductive layer structure and removing material of the electrically insulating layer structure below the window by a first laser beam, and subsequently removing further material of the electrically insulating layer structure below the window by a second laser beam having a smaller size than a size of the window.