Dual-Layer Back Cover for OLED Heat Dissipation
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Solution Overview
Problem
Organic light-emitting display devices face challenges with heat dissipation due to the vulnerability of organic light-emitting elements, and existing support structures often compromise on heat dissipation efficiency while increasing manufacturing costs and thickness.
Innovation Solution
A display device with a back cover structure comprising a first and second back cover with thermal conductivity, where the second back cover has a smaller area than the first, and a connector integrally formed with them, supports the display panel while enhancing heat dissipation and reducing the need for a separate inner plate, thus improving heat dissipation performance and reducing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the thickness of the back cover or inner plate is increased to secure the rigidity of the support structure, then the rigidity is improved, but the heat dissipation performance deteriorates
Solution Approach 1:
The back cover is divided into a first back cover and a second back cover stacked on top of each other. The first back cover provides structural support and rigidity, while the second back cover with smaller area enhances heat dissipation performance. This segmentation allows each part to optimize its function without compromising the other.
Solution Approach 2:
The support structure uses a composite configuration combining the first back cover (for rigidity) and the second back cover (for heat dissipation). The first adhesive member with heat dissipation material further enhances thermal conductivity. This composite approach resolves the contradiction by integrating materials and structures with different primary functions.
2Temperature
If a separate inner plate is added to enhance heat dissipation, then the heat dissipation performance is improved, but the device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the heat dissipation function into the back cover structure itself by adding the second back cover and heat dissipation material, eliminating the need for a separate inner plate. This integration reduces structural complexity while maintaining heat dissipation performance.
Solution Approach 2:
The back cover structure serves multiple functions: the first back cover provides structural support, the second back cover enhances heat dissipation, and the heat dissipation material in the adhesive member further improves thermal conductivity. This multi-functionality reduces the need for separate components.
3Weight of stationary object
If the area of the second back cover is reduced, then the manufacturing cost and weight are reduced, but the heat dissipation area is reduced
Solution Approach 1:
The second back cover has a smaller area than the first back cover, concentrating heat dissipation functionality in a localized region. The heat dissipation material is strategically placed in the adhesive member area where thermal conductivity is most needed, optimizing heat dissipation efficiency within a compact footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively enhances heat dissipation performance, maintains high flexural stiffness, reduces the overall weight, simplifies the structure, and prevents moisture permeation, enabling a narrow bezel design while protecting the display panel from damage during handling.
Implementation Method 1
the back cover has thermal conductivity
Implementation Method 2
The first adhesive member includes a heat dissipation material
Data Source
AI summary
Discussed is a display device capable of improving heat dissipation performance. The display device includes a display panel, and a back cover to support the display panel, wherein the back cover includes a first back cover stacked on the display panel and a second back cover stacked on the first back cover, where the back cover has thermal conductivity.