Dual-Layer Buffer Material for HDD Shock Absorption

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Solution Overview

Problem

Existing electronic apparatuses face challenges in effectively absorbing vibrations and impacts, particularly in notebook personal computers, where conventional buffer materials fail to adequately mitigate external disturbances, leading to potential damage to internal components like hard disk drives.

Innovation Solution

The use of a dual-layer buffer material configuration, comprising a first buffer material that buckles under excessive load and has restorability, and a second buffer material that deforms in response to smaller loads, strategically positioned between components to absorb and dissipate vibrations and impacts, enhancing the overall shock resistance and durability of the apparatus.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional single-layer buffer materials are used, then the structure is simple, but the vibration and impact absorption capability is insufficient

Engineering Contradiction:
Improvevibration and impact absorption capabilityVSAvoidbuffer material structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The buffer material is segmented into multiple layers with different material properties. The first layer (closer to the disk device) has softer elasticity to absorb low-intensity vibrations, while the second layer (outer layer) has harder elasticity to absorb high-intensity impacts. This segmentation allows each layer to specialize in absorbing specific types of shocks, thereby improving overall protection capability without requiring an overly complex multi-component system.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention uses composite buffer material structure combining two different elastic materials with distinct hardness characteristics. By integrating materials with different mechanical properties (soft elastic material for vibration absorption, hard elastic material for impact absorption) into a single buffer assembly, the system achieves superior shock resistance while maintaining structural simplicity through material composition rather than mechanical complexity.

Inventive Principle:
Principle #40Composite materials

2Reliability

If buffer materials are arranged to absorb all types of loads, then the protection capability is improved, but the design complexity increases

Engineering Contradiction:
Improveshock resistanceVSAvoidbuffer material arrangement
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

Different regions of the buffer structure have different material properties tailored to local requirements. The first layer positioned adjacent to the disk device uses softer material to locally optimize for vibration absorption, while the second outer layer uses harder material to locally optimize for impact absorption. This local differentiation of material quality allows the buffer system to handle multiple load types effectively without requiring a uniformly complex design throughout the entire structure.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration significantly reduces the impact of external vibrations and shocks on electronic components, improving the apparatus's shock resistance and durability while maintaining a slim design, effectively protecting sensitive parts like hard disk drives from damage.

Implementation Method 1

a first buffer material, partially buckles when the load, acting between the first component and the second component, exceeds a predetermined value, and that has restorability to its original shape after buckling

Methodology Applied
Scientific EffectBuckling:

Implementation Method 2

that has restorability to its original shape after buckling

Methodology Applied
Scientific EffectElastic recovery: Elastic Recovery

Implementation Method 3

a second buffer material configured to deform in response to a load that is smaller than the predetermined value and that acts between the first component and the second component

Methodology Applied
Scientific EffectDeformation: Deformation

Data Source

PatentUS8988871B2Electronic apparatus and buffer material
Publication Date: 2015.03.24 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
  • US8988871B2 patent drawing
  • US8988871B2 patent drawing
  • US8988871B2 patent drawing

AI summary

Mounted between bottom and top surfaces of a case are: second buffer materials and first buffer materials brought in surface contact with a bottom surface of a hard disk drive (HDD) via an insulating member, and upper buffer materials brought in surface contact with the opposite side of the HDD via the insulating member. When impact F2 is applied to the HDD, the second buffer materials contract from a thickness of T0 to T2, and the first buffer materials buckle. Buckling parts of the first buffer materials buckle when the second buffer materials contract to thickness T2, and can achieve impact-lessening independently from the second buffer materials. The second buffer materials contract singly from T0 to equal T1 to or more than T2, whereas the first buffer materials and second buffer materials both act at thickness T2 or beyond. Therefore, impact-lessening can be achieved in a broad range.