Dual Layer Bus Architecture for SOC Bandwidth Management

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Solution Overview

Problem

Conventional SOC architectures face performance issues and high power consumption when processing multimedia data in MPEG formats due to overwhelming bandwidth demands, particularly during encoding and decoding processes.

Innovation Solution

A dual layer SOC bus architecture is introduced, featuring a main bus connecting critical modules to high-density main memory and a high-speed secondary bus connecting these modules to high-speed secondary memory, allowing bandwidth division and efficient data transfer between main and secondary memory.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If conventional SOC architectures use a single bus to connect all modules to memory, then device complexity is reduced, but bandwidth capacity is insufficient for multimedia processing

Engineering Contradiction:
Improvebus architecture complexityVSAvoidbandwidth capacity
Core Design Contradiction:
Device complexityVSQuantity of substance

Solution Approach 1:

The patent divides the single bus into two separate buses: a first bus for connecting processing modules to first memory, and a second bus for connecting processing modules to second memory. This segmentation allows independent data transfer paths, increasing overall bandwidth capacity without requiring a single complex high-capacity bus.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces a second dimension to the memory architecture by adding another memory bank (second memory) accessible through a separate bus. This transforms the single-dimensional memory access pattern into a two-dimensional memory hierarchy, enabling parallel data retrieval and increasing effective bandwidth.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If conventional SOC architectures use a single bus architecture, then manufacturing simplicity is maintained, but multimedia processing performance is insufficient

Engineering Contradiction:
Improvebus architecture implementationVSAvoidmultimedia processing performance
Core Design Contradiction:
Ease of manufactureVSProductivity

Solution Approach 1:

The bus architecture is segmented into two independent buses that can be manufactured and tested separately before integration. Each bus connects specific modules to corresponding memory banks, allowing modular fabrication processes that maintain ease of manufacture while achieving higher processing performance through parallel data paths.

Inventive Principle:
Principle #1Segmentation

3Device complexity

If data is transferred through a single bus during encoding/decoding, then bus architecture simplicity is maintained, but main system bus bandwidth is overwhelmed

Engineering Contradiction:
Improvebus architectureVSAvoidbandwidth consumption
Core Design Contradiction:
Device complexityVSLoss of energy

Solution Approach 1:

The patent segments bandwidth demands by routing different data transfers through separate buses. The first bus handles transfers for the first memory while the second bus handles transfers for the second memory, preventing any single bus from being overwhelmed and reducing overall energy consumption associated with high-bandwidth single-bus transfers.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS7508981B2Dual layer bus architecture for system-on-a-chip
Publication Date: 2009.03.24 SAMSUNG ELECTRONICS CO LTD
  • US7508981B2 patent drawing
  • US7508981B2 patent drawing
  • US7508981B2 patent drawing

AI summary

A dual layer bus architecture for a system-on-a-chip (SOC) is disclosed. The bus architecture comprises a main bus adapted to connect a microprocessor, an image capture module, and a dual master module to a high density memory and a secondary memory operating independently of the main bus and adapted to connect the dual master module to a high-speed secondary memory.