Dual-Layer Carbon Gap Fill for Planarization

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Solution Overview

Problem

Traditional methods for filling gaps on a substrate surface with carbon material, such as spin-on carbon, often result in surfaces that are not flat enough for subsequent processing, leading to variations in critical dimensions and line edge roughness, and are costly due to additional processing steps and equipment requirements.

Innovation Solution

The method involves forming two carbon layers with different properties, where the first layer has a higher density than the second layer, allowing for smooth filling of recesses without voids and enabling chemical mechanical polishing to achieve a flat surface, with the second layer being less dense for polishing and the first layer providing stability for pattern transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If traditional carbon deposition techniques (such as spin-on carbon) are used to fill gaps, then the gaps can be filled with carbon material, but the surface flatness and smoothness are insufficient for subsequent processing

Engineering Contradiction:

Improvesurface flatnessVSAvoidprocessing complexity

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The carbon fill layer is divided into multiple sub-layers (first carbon sub-layer and second carbon sub-layer) with different properties. The first sub-layer provides structural support and void-free filling, while the second sub-layer provides a smooth surface for subsequent processing, eliminating the need for additional CMP steps.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent uses a composite structure combining two different carbon materials with distinct properties. The first carbon material has higher density and provides structural integrity, while the second carbon material has lower density and provides surface smoothness, achieving both filling and planarization functions simultaneously.

Inventive Principle:

Principle #40Composite materials

2Manufacturing precision

If chemical mechanical polishing (CMP) is used to flatten the carbon material surface, then surface flatness can be improved, but additional processing time and cost are incurred

Engineering Contradiction:

Improvesurface flatnessVSAvoidmanufacturing throughput

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The patent performs planarization during the deposition process itself by forming the second carbon sub-layer with inherently smooth properties, rather than performing CMP as a separate post-processing step. This preliminary action eliminates the need for additional polishing equipment and processing time.

Inventive Principle:

Principle #10Preliminary action

3Quantity of substance

If spin-on carbon processes with additional equipment (coaters and ovens) are used, then carbon material can be deposited, but processing cost and time increase

Engineering Contradiction:

Improvecarbon material depositionVSAvoidprocessing time

Core Design Contradiction:

Quantity of substanceVSLoss of time

Solution Approach 1:

The patent replaces the mechanical spin-coating process with a vapor-phase deposition process, eliminating the need for spin coaters and ovens. The carbon material is deposited directly from the vapor phase, reducing equipment requirements and processing steps while maintaining effective gap filling.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces critical dimension variations and line edge roughness, enhances manufacturing throughput, and provides a cost-effective solution by minimizing the need for additional processing steps and equipment, while ensuring a smooth surface suitable for subsequent processing steps.

Implementation Method 1

the step of forming the first and/or second carbon layer comprises a plasma process

Methodology Applied

Scientific EffectPlasma: Plasma

Implementation Method 2

The step of chemical mechanical polishing can be used to remove at least a portion of the second carbon layer

Methodology Applied

Scientific EffectChemical mechanical polishing:

Implementation Method 3

The steps of etching the first carbon layer and the second carbon layer can include ionic etching

Methodology Applied

Scientific EffectIonic etching:

Data Source

PatentUS11705333B2Structures including multiple carbon layers and methods of forming and using same

Publication Date: 2023.07.18 ASM IP HLDG BV

AI summary

Methods and systems for forming a structure including multiple carbon layers and structures formed using the method or system are disclosed. Exemplary methods include forming a first carbon layer and a second carbon layer, wherein a density and/or other property of the first carbon layer differs from the corresponding property of the second carbon layer.