Dual-Layer Cooling Element for Electronic Components
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Solution Overview
Problem
Conventional liquid cooling systems for electronic components require large heat sinks with complex piping arrangements, occupying significant space, especially when multiple components need cooling, and fail to effectively balance temperature distribution across both surfaces of the cooling element.
Innovation Solution
A dual-layer cooling element with interconnected channels on both surfaces, utilizing insert pieces to create liquid connections between upper and lower channels, allowing for simplified piping and balanced temperature management by circulating cooling liquid through both layers from a single end, with optional thermal conductivity coatings for enhanced heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional liquid cooling systems with separate heat sinks and piping arrangements are used for multiple electronic components, then effective cooling is achieved, but the device occupies significant space and becomes complex
Solution Approach 1:
The patent combines multiple separate cooling functions into a single integrated cooling element with multiple channels. Instead of using separate heat sinks and piping arrangements for different electronic components, the invention provides one cooling element that can cool multiple components simultaneously through its multi-channel structure, thereby reducing overall system complexity and space occupation while maintaining effective cooling
Solution Approach 2:
The cooling element is designed with universal applicability to cool different types of electronic components (such as capacitors and inductors) through its multiple channels. Each channel can be independently configured to cool specific components, making the single cooling element capable of performing multiple cooling functions that would otherwise require separate dedicated cooling systems
2Reliability
If conventional liquid cooling systems with separate heat sinks are used for multiple components, then each component is cooled effectively, but the number of cooling elements and space required increases
Solution Approach 1:
The patent merges multiple separate cooling elements into a single integrated cooling element with multiple channels. This consolidation reduces the total volume occupied by cooling systems while maintaining the ability to cool multiple electronic components effectively, as each channel within the single element can be directed to cool specific components
3Temperature
If cooling liquid is circulated through separate channels for different surfaces, then temperature balance is achieved, but piping complexity increases
Solution Approach 1:
The patent combines the cooling circuits for different surfaces into a single integrated piping arrangement. The cooling element features channels on both first and second surfaces that are interconnected through the body of the cooling element, allowing a single piping system to distribute cooling liquid to multiple channels and maintain temperature balance across different surfaces without requiring separate complex piping arrangements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the number of separate cooling elements needed, simplifies piping, and ensures effective cooling of both surfaces, maintaining efficient temperature balance and compactness in electronic devices, while allowing for flexible modification to accommodate different components.
Implementation Method 1
the cooling body (1) comprises multiple of channels (2, 3) for cooling liquid... both surfaces of the cooling element can be used for cooling electronic components
Implementation Method 2
heat sinks with liquid circulation the heat from the components is led to a circulating liquid and the heat from the liquid is removed at a desired location
Implementation Method 3
with optional thermal conductivity coatings for enhanced heat transfer
Data Source
Figure 1~2
Figure 3~4
AI summary
A cooling element comprising a cooling body, the cooling body comprising a first surface and a second surface, the first surface and the second surface being on the opposing sides of the body and the distance between the first and second surfaces defining the height of the cooling body, multiple of channels for cooling liquid arranged inside the cooling body, the channels extending in a longitudinal direction of the cooling body, wherein the channels are arranged in two layers in the direction of the height of the cooling body inside the cooling body and the cooling element is adapted to hold electronic components on the first surface and on the second surface for cooling electronic components on both surfaces.