Dual-Layer Cover Member for Electronic Component Resin Molding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic components with mold resin layers face damage during resin molding due to pressure-induced deformation of the cover member, which can lead to contact with sensitive electrodes and potential damage.
Innovation Solution
The electronic component design includes a dual-layer cover member system with a first cover member having a higher glass transition temperature than the second cover member, both bonded to a support layer, creating a gap that reduces pressure transmission and prevents deformation, thereby protecting the electrodes. The method involves thermally curing the cover member and applying a mold resin layer to seal the component.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single-layer cover member with lower elastic modulus than mold resin is provided, then durability against pressure impact is improved, but the cover member deforms under pressure during resin molding
Solution Approach 1:
The cover member is divided into two layers: a first cover member layer with lower elastic modulus than the mold resin to absorb pressure impact, and a second cover member layer with higher elastic modulus than the mold resin to maintain structural stability and prevent deformation during resin molding
Solution Approach 2:
The cover member uses a composite structure combining two different resin materials with contrasting elastic modulus properties, where the first layer provides impact absorption and the second layer provides structural rigidity, achieving both durability and dimensional stability
2Stability of the object's composition
If the cover member is made more rigid to prevent deformation, then cover member stability is improved, but the ability to absorb pressure impact is reduced
Solution Approach 1:
The cover member is segmented into two functional layers: the first layer with lower elastic modulus serves as a shock-absorbing cushion, while the second layer with higher elastic modulus provides structural support and stability, allowing both functions to coexist
Solution Approach 2:
The first cover member layer with lower elastic modulus acts as a pre-positioned cushion that absorbs pressure impact before it reaches the second layer, protecting the overall structure from damage while maintaining stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly reduces the risk of damage to the electronic component during resin molding and operation by minimizing pressure-induced deformation and maintaining air-tightness, ensuring the integrity of the electrodes and the mold resin layer.
Implementation Method 1
The glass transition temperature of the first cover member is higher than that of the second cover member
Implementation Method 2
a mold resin layer provided on the package substrate so as to seal a periphery of the electronic component element
Data Source
AI summary
An electronic component includes a package substrate, an electronic component element mounted on the package substrate and includes an element substrate, a support layer, and a cover member, and a mold resin layer provided on the package substrate so as to seal the electronic component element. The cover member includes a first cover member provided on the package substrate and a second cover member provided on the first cover member. The glass transition temperature of a resin material of the first cover member is higher than that of a resin material of the second cover member.