Dual-Layer Current Collector Oxidation Protection
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Solution Overview
Problem
Current methods for producing microelectronic devices with electrode and current collector parts, particularly in electrochemical energy storage, require high-temperature thermal steps that can degrade non-platinum materials and necessitate the use of expensive platinum for maintaining electrical conduction properties.
Innovation Solution
A dual-layer current collector structure is introduced, where a first layer provides electronic conductivity and a second, thinner layer protects against oxidation during high-temperature treatments, allowing for the use of less expensive materials and maintaining electrical conduction properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a single-layer current collector made of non-platinum material is used, then material cost is reduced, but the current collector degrades during high-temperature heat treatment due to oxidation
Solution Approach 1:
The current collector is constructed as a composite structure with a first layer (e.g., copper or aluminum) providing electrical conductivity and a second layer (e.g., titanium nitride or chromium nitride) providing oxidation resistance. This composite approach allows the device to use cheaper materials while maintaining performance after high-temperature heat treatment, as the second layer protects the first layer from oxidizing during the thermal processing of the electrode.
2Reliability
If platinum is used as the current collector material, then electrical conduction properties are maintained after heat treatment, but material cost increases significantly
Solution Approach 1:
The current collector is segmented into two functional layers: a first layer responsible for electrical conduction and a second layer responsible for oxidation protection. This segmentation allows each layer to be optimized for its specific function using cost-effective materials, replacing the need for expensive platinum while maintaining the same level of reliability after heat treatment.
3Manufacturing precision
If high-temperature heat treatment is applied to crystallize the electrode material, then electrode performance is improved, but the current collector oxidizes and degrades
Solution Approach 1:
The second layer is deposited on the first layer before the high-temperature heat treatment step. This preliminary protective coating prevents oxidation of the current collector during the subsequent heat treatment that is necessary for crystallizing the electrode material, allowing the heat treatment to proceed without degrading the current collector.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively prevents oxidation of the first collector layer during heat treatments, reducing material costs and maintaining the device's electrical performance, thus enhancing the production of microelectronic devices without relying on expensive materials like platinum.
Implementation Method 1
the second collecting layer is configured to protect the covered part during the heat treatment, such that the heat treatment does not oxidise said covered part
Implementation Method 2
a thermal oxidation under air or under dioxygen is carried out, of which the purpose is to crystallise the material of the first electrode
Implementation Method 3
the purpose is to crystallise the material of the first electrode
Implementation Method 4
the first current collector... capable of conserving the electrical conduction properties thereof after the heat treatment
Data Source
AI summary
The present invention relates to a method for producing a microelectronic device, successively including:forming a first current collector on a face of a substrate;forming a first electrode on, and in electrical continuity with, a portion of the first current collector;heat treating the first electrode wherein:forming the first collector comprises forming a first collector layer on the face of the substrate and forming a second collector layer covering at least one part to produce a covered part of the first collector layer and having a first face in contact with the first electrode,the second collector layer is configured to protect the covered part during the heat treating, such that the heat treating does not oxidise the covered part.


