Dual-Layer Inductor With Thin Support Member
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Solution Overview
Problem
The challenge is to miniaturize inductors while maintaining required characteristics, as they need to be implemented at a small thickness in response to the rapid miniaturization and thinning of apparatuses driven by information technology advancements.
Innovation Solution
The solution involves an inductor design with a support member having a thickness between two coil patterns, where the support member's thickness is 1/10 to 1/3 of the coil pattern thickness, and a manufacturing method that includes forming a support member on a delamination substrate, creating coil patterns on both surfaces, and removing the substrate to achieve a thin structure without damaging the coil patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the thickness of the support member is reduced to achieve miniaturization, then the inductor thickness is reduced, but the structural integrity and magnetic flux characteristics deteriorate
Solution Approach 1:
The patent transitions from a single-layer coil structure to a dual-layer coil structure formed on opposite surfaces of the support member. This dimensional change allows the magnetic flux paths to be distributed in three-dimensional space, improving magnetic coupling and structural integrity while maintaining reduced thickness. The first and second coil patterns are positioned at different depths, creating a stacked configuration that enhances overall performance without increasing the inductor's thickness.
Solution Approach 2:
The patent implements a nested structure where the first coil pattern and second coil pattern are positioned within the thickness profile of the support member, with each coil pattern embedded in its respective surface region. The support member itself is nested within the overall inductor structure, providing mechanical support while the coils are nested within the magnetic path. This nested arrangement allows efficient use of the limited thickness space while maintaining structural strength.
2Length of moving object
If the support member thickness is reduced to 1/10 to 1/3 of the coil pattern thickness, then miniaturization is achieved, but manufacturing complexity increases
Solution Approach 1:
The manufacturing process is segmented into distinct stages: forming the support member with insulating film on a delamination substrate, forming the first coil pattern on one surface, forming a complementary layer, removing the delamination substrate, and forming the second coil pattern on the other surface. This segmentation allows each step to be optimized independently and simplifies the overall manufacturing complexity by breaking down the complex thin-film fabrication into manageable sequential operations.
Solution Approach 2:
The delamination substrate serves as an intermediary element during manufacturing. It provides a temporary support structure that enables precise formation of the thin support member and first coil pattern, then allows for clean removal to expose the other surface for second coil pattern formation. This intermediary substrate simplifies the manufacturing process by providing a workable platform during fabrication that can be easily removed afterward, reducing the complexity of handling extremely thin structures directly.
Data Source
AI summary
There are provided an inductor and a method of manufacturing the same. The inductor includes: a support member; a first coil pattern formed on one surface of the support member; and a second coil pattern formed on the other surface of the support member, wherein a thickness of the support member between the first coil pattern and the second coil pattern is 1/10 or more of a thickness of the first coil pattern and is less than ⅓ of the thickness of the first coil pattern.