Dual-Layer Peelable Liner for Residue-Free Optical Wafer Protection
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Solution Overview
Problem
Existing peelable liners for optical wafers in ophthalmic lenses cause cosmetic defects such as wavy patterns and residues during the forming process, failing to meet requirements for mass production due to inappropriate materials and designs.
Innovation Solution
A peelable liner comprising two distinct polymer layers with specific melting points (100-135°C and 140-170°C) and thicknesses (at least 5μm and 30μm respectively) to ensure easy peeling without residues and minimize pattern transfer to the wafer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a single-layer polypropylene liner is used to protect the wafer, then the wafer is protected from contamination and scratches, but wavy patterns are transferred to the wafer during the forming process
Solution Approach 1:
The liner is divided into two distinct layers: an inner layer (5-50 μm) made of low-melting-point polymer and an outer layer (30-100 μm) made of high-melting-point polymer. This segmentation allows each layer to perform different functions - the inner layer protects without transferring waves, while the outer layer provides structural support and prevents contamination.
Solution Approach 2:
The liner uses a composite structure combining two different polymers with distinct melting points and properties. The inner layer uses a polymer with Tm of 50-150°C that conforms to the wafer surface without transferring wavy patterns, while the outer layer uses a polymer with Tm of 150-200°C that provides mechanical protection and resistance to contamination during the forming process.
2Object-affected harmful factors
If the liner thickness is increased to improve protection, then protection efficiency is improved, but peeling difficulty and residue formation increase
Solution Approach 1:
The invention optimizes the thickness parameters of each layer: the inner layer is kept thin (5-50 μm) to ensure easy peeling and complete removal without residues, while the outer layer is thicker (30-100 μm) to provide sufficient mechanical protection. The specific thickness range balances protection efficiency with peeling ease.
Solution Approach 2:
Different regions of the liner have different thicknesses and material properties tailored to their specific functions. The inner layer adjacent to the wafer is thinner and made of low-melting-point polymer for easy peeling, while the outer layer is thicker and made of high-melting-point polymer for enhanced protection against contamination and mechanical damage.
3Temperature
If a liner with high melting point polymer is used to withstand forming temperatures, then thermal stability is improved, but the liner sticks to operator gloves and causes handling issues
Solution Approach 1:
The liner is segmented into two layers with different thermal properties. The outer layer uses high-melting-point polymer (Tm 150-200°C) to withstand forming temperatures and provide thermal stability, while the inner layer uses low-melting-point polymer (Tm 50-150°C) that does not stick to operator gloves during handling, resolving the contradiction between thermal stability and handling ease.
4Ease of operation
If the liner is designed for easy peeling, then peelability is improved, but edge peeling and unwanted peeling during handling occur
Solution Approach 1:
The liner exhibits different adhesive properties at different locations and interfaces. The inner layer has controlled adhesion to the wafer that allows easy peeling from the center while maintaining edge stability and preventing unwanted peeling during handling. The outer layer provides structural support that prevents edge peeling and ensures controlled peeling behavior throughout the entire liner-wafer assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed liner significantly reduces wavy patterns and residues on formed wafers, enhancing suitability for mass production by providing excellent adhesion and peelability.
Implementation Method 1
a film A comprising one or more liner layers A each comprising a polymer A independently chosen from polymers having a melting point (Tm) of 100° C. to 135° C., and a film B comprising one or more liner layers B each comprising a polymer B independently chosen from polymers having a melting point of 140° C. to 170° C.
Data Source
AI summary
A peelable liner for protecting an optical wafer or a multilayer film from which the optical wafer can be cut, said liner comprising a film A comprising one or more liner layers A each comprising a polymer A independently chosen from polymers having a melting point (Tm) of 100° C. to 135° C., and a film B comprising one or more liner layers B each comprising a polymer B independently chosen from polymers having a melting point of 140° C. to 170° C., said film A comprising a first face configured to be in direct contact with the optical wafer when the liner adheres to the optical wafer and a second face opposite the first face, and said film B being placed on the second face of film A, wherein the total thickness of the one or more liner layers A is of at least 5 μm and the total thickness of the one or more liner layers B is of at least 30 μm.