Dual-Layer Wiring Board Module for Heat and Noise Isolation
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Solution Overview
Problem
Current electronic modules face limitations in achieving high integration due to constraints in circuit component attachment and heat management, leading to reduced performance and stability of electrooptical devices like image sensors and displays.
Innovation Solution
A module design featuring a dual-layer wiring board structure with an electrooptical component mounted on one board and an integrated circuit component on another, connected by soldered connecting members that reduce heat conduction and noise interference, allowing for increased integration and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If components are attached to a substrate on which an electronic device is mounted, then integration is achieved, but heat conduction and noise interference increase
Solution Approach 1:
The module is divided into two separate wiring boards: a first wiring board for mounting the electrooptical component and a second wiring board for mounting the integrated circuit component. This segmentation physically separates heat-generating components, reducing heat conduction between them while maintaining functional integration through the connecting member.
Solution Approach 2:
A connecting member serves as an intermediary element between the first and second wiring boards. This connecting member provides electrical connection while being designed to minimize heat conduction and noise interference, acting as a mediator that enables integration without transmitting harmful thermal and electromagnetic effects.
2Device complexity
If components are attached to a substrate on which an electronic device is mounted, then integration is achieved, but noise interference increases
Solution Approach 1:
By segmenting the module into separate wiring boards for electrooptical and integrated circuit components, the patent reduces electromagnetic noise interference between components. The physical separation minimizes cross-talk and interference while the connecting member maintains necessary electrical connections.
Solution Approach 2:
The connecting member acts as an intermediary that facilitates electrical connection between wiring boards while being designed to minimize noise interference. This mediator approach allows integration benefits while filtering or reducing the transmission of electromagnetic noise between different functional areas.
3Device complexity
If higher integration is pursued, then circuit component attachment is increased, but heat management becomes more difficult
Solution Approach 1:
The patent applies segmentation by creating separate wiring boards for different functional components. This segmentation distributes heat-generating sources across separate physical substrates, improving heat management through better thermal dissipation pathways and reducing localized overheating issues that would arise from high integration on a single board.
Solution Approach 2:
The patent transitions from planar integration on a single substrate to three-dimensional stacking with multiple wiring boards connected vertically. This dimensional change allows heat to dissipate in additional directions and separates heat-generating components in the vertical dimension, improving overall heat management while maintaining high integration density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the integration and stability of electrooptical components by reducing thermal noise and inductive noise, leading to improved performance and image quality in devices such as image sensors and displays.
Implementation Method 1
the connecting member being soldered to the first wiring board and the second wiring board
Implementation Method 2
the connecting member being soldered to the first wiring board and the second wiring board
Data Source
AI summary
A first wiring board, a first component mounted on the first wiring board, a second wiring board overlapping the first wiring board, a second component mounted on the second wiring board, and a connecting member disposed between the first wiring board and the second wiring board, the connecting member being soldered to the first wiring board and the second wiring board, the connecting member electrically connecting the first wiring board to the second wiring board, are provided.