Dual-Layer Mold for Optoelectronic Lighting

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Solution Overview

Problem

Existing lighting devices with radiation-emitting components lack robust mechanical and optical properties, leading to inefficient radiation management and mechanical stability.

Innovation Solution

A method involving a radiation-emitting optoelectronic component arranged on a carrier, surrounded by a first layer acting as a circumferential frame with high optical density, and a second layer with greater hardness applied laterally, providing a stable mechanical housing and precise radiation surface definition.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a single mold material is used to surround the radiation-emitting component, then the manufacturing process is simple, but the mechanical robustness and optical properties are insufficient

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidmechanical robustness and optical properties
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The mold material is segmented into two distinct layers: a first mold material layer and a second mold material layer. This segmentation allows each layer to have specialized properties - the first layer provides mechanical robustness while the second layer enhances optical properties, resolving the contradiction between manufacturing simplicity and performance requirements.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the mold material are assigned different qualities through the two-layer structure. The first layer (closer to the radiation-emitting component) is optimized for mechanical support, while the second layer (outer layer) is optimized for optical performance. This local differentiation of material properties enables both mechanical robustness and superior optical characteristics without complicating the overall manufacturing process.

Inventive Principle:
Principle #3Local quality

2Strength

If the mold material has high hardness for mechanical stability, then mechanical durability is improved, but optical properties and radiation management are compromised

Engineering Contradiction:
Improvemechanical durabilityVSAvoidoptical properties and radiation management
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The mold material is divided into two functional layers: the first layer provides the necessary mechanical durability and structural support, while the second layer is specifically designed to optimize optical properties and radiation management. This segmentation allows each layer to excel at its designated function without compromising the other.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The first layer is positioned adjacent to the radiation-emitting component where mechanical support is most critical, while the second layer is positioned externally where optical performance is paramount. This spatial differentiation of material qualities ensures that mechanical strength and optical properties are both optimized in their respective zones.

Inventive Principle:
Principle #3Local quality

3Manufacturing precision

If lateral radiation is not blocked, then the radiation surface is not well-defined, but allowing lateral radiation propagation reduces optical efficiency

Engineering Contradiction:
Improveradiation surface definitionVSAvoidoptical efficiency
Core Design Contradiction:
Manufacturing precisionVSLoss of energy

Solution Approach 1:

The mold material structure is designed with local optical properties that control radiation propagation. The two-layer configuration creates specific optical pathways that confine and direct radiation from the emitting component, thereby defining the radiation surface precisely while preventing energy loss through uncontrolled lateral propagation.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS10680147B2Method of producing a lighting device
Publication Date: 2020.06.09 AMS OSRAM INT GMBH
  • US10680147B2 patent drawing
  • US10680147B2 patent drawing
  • US10680147B2 patent drawing

AI summary

A method of producing a lighting device includes a radiation-emitting optoelectronic component, including: arranging the component on a carrier, applying a first layer on the carrier, wherein the first layer surrounds the component at least laterally in the form of a circumferential frame, and subsequently applying a second layer on the first layer laterally next to the frame, wherein the second layer includes a greater hardness than the first layer.