Dual-Layer Encapsulation Lens for Optoelectronic Component Light Extraction
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Solution Overview
Problem
Current optoelectronic components lack mechanical stability and efficient light extraction, with existing encapsulation methods failing to effectively direct electromagnetic radiation.
Innovation Solution
The use of two transparent encapsulation bodies with different refractive indices to form a total inner reflection lens, combined with a reflector layer, enhances mechanical stability and increases light extraction by directing radiation towards the optical axis.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a single encapsulation body is used, then the structure is simple, but mechanical stability is insufficient
Solution Approach 1:
The encapsulation body is divided into two distinct parts: a first encapsulation body (4) with a lens shape that has a smaller refractive index, and a second encapsulation body (6) with a larger refractive index. This segmentation allows each part to perform specific functions - the first body provides mechanical support and basic encapsulation, while the second body optimizes light extraction - thereby improving mechanical stability without excessive complexity.
Solution Approach 2:
The patent employs composite encapsulation structures where two materials with different refractive indices are combined. The first encapsulation body uses a material with lower refractive index (such as silicone or epoxy), while the second encapsulation body uses a material with higher refractive index. This composite approach enhances mechanical stability by distributing structural loads while optimizing optical performance through refractive index differentiation.
2Loss of energy
If conventional encapsulation is used, then manufacturing is simple, but light extraction efficiency is poor
Solution Approach 1:
The patent applies local quality by creating regions with different refractive indices at specific locations within the encapsulation structure. The second encapsulation body with higher refractive index is positioned specifically to optimize light extraction from the semiconductor chip interface, while the first encapsulation body with lower refractive index handles other regions. This localized optimization of refractive index properties significantly improves light extraction efficiency without requiring complete structural redesign.
Solution Approach 2:
The invention changes the refractive index parameter by using two different materials with distinct refractive index values. The first encapsulation body has a smaller refractive index while the second encapsulation body has a larger refractive index. This parameter differentiation creates optimal conditions for total internal reflection and light extraction at the interface between the semiconductor chip and the encapsulation structures, thereby reducing energy loss without excessive complexity.
3Illumination intensity
If radiation is emitted in all directions, then emission coverage is broad, but directional emission is weak
Solution Approach 1:
The first encapsulation body is designed with a lens shape featuring curved surfaces, while the second encapsulation body complements this curvature. These curved geometries are specifically engineered to refract and direct emitted radiation toward the optical axis. The spherical/curved surfaces naturally focus light in specific directions while maintaining broad emission coverage, thereby achieving high directional emission intensity without excessively restricting the emission angle range.
Solution Approach 2:
The two encapsulation bodies act as optical intermediaries between the semiconductor chip and the external environment. They mediate the transformation of omnidirectional radiation from the chip into directional emission by utilizing refractive index differences and curved surface geometries. This intermediary function allows the system to maintain broad emission coverage while significantly enhancing directional emission intensity through controlled refraction and total internal reflection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves mechanical stability and light extraction efficiency, allowing for a broader emission angle range and increased directional emission of electromagnetic radiation.
Implementation Method 1
The first encapsulation body and the second encapsulation body form a total inner reflection lens
Implementation Method 2
two transparent encapsulation bodies with different refractive indices
Data Source
AI summary
The invention relates to an optoelectronic component comprisingat least one optoelectronic semiconductor chip which is designed to generate or detect electromagnetic radiation,a carrier on which the semiconductor chip is arranged,a first encapsulation body into which the optoelectronic semiconductor chip is embedded, anda second encapsulation body, whereinthe first encapsulation body has a first thickness above the semiconductor chip and has a second thickness laterally spaced from the semiconductor chip,the first thickness is less than the second thickness,a third thickness of the first encapsulation body between the first thickness and the second thickness is minimal, andthe second encapsulation body is arranged on the first encapsulation body.