Transfer system for electronic-technology textile printing
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Solution Overview
Problem
Existing double-layer polymer systems for transferring and applying electronic components on textile substrates face issues with elasticity, leading to elongation of conductive circuits, incorrect electrical conductivity, unstable clamping, and low thermal and dimensional stability, resulting in faulty device operation and alignment problems during processing.
Innovation Solution
A dual-layer system comprising a thermally and dimensionally stabilized transparent polymer film with a surface treatment and a low-melting polyurethane film, allowing for stable adherence and consistent electrical conduction, even under mechanical stress and thermal variations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a double-layer polymer system is used for transferring electronic components on textile substrates, then the system provides flexibility and adherence, but the elasticity causes elongation of conductive circuits and incorrect electrical conductivity
Solution Approach 1:
The system is divided into three distinct layers: a dimensionally stable polymer film (0.05-0.2 mm thick), a thin polyurethane adhesive layer (0.01-0.05 mm thick), and a conductive ink layer. This segmentation isolates the dimensional stability function from the flexibility function, allowing the conductive circuits to remain stable while the overall system remains flexible for transfer applications.
Solution Approach 2:
The patent specifies precise parameter ranges: polymer film thickness of 0.05-0.2 mm, polyurethane layer thickness of 0.01-0.05 mm, and melting temperature of 80-120°C. By controlling these parameters, the system achieves optimal balance between flexibility for transfer and dimensional stability for electrical conductivity, preventing circuit elongation.
2Strength
If a double-layer polymer system is used for transferring electronic components, then the system provides adherence to textile substrates, but the thermal and dimensional stability is low, causing alignment problems during processing
Solution Approach 1:
The polymer film undergoes preliminary thermal treatment at 80-120°C for 5-30 minutes before the transfer process to pre-establish dimensional stability. The polyurethane layer is also pre-applied and cured to ensure proper adhesion properties before the actual transfer, preventing alignment issues during processing.
Solution Approach 2:
The system uses a composite structure combining a dimensionally stable polymer film (such as polyester or polyimide) with a polyurethane adhesive layer. The polymer film provides thermal and dimensional stability, while the polyurethane layer provides adherence to textile substrates, resolving the contradiction between these two properties.
3Ease of manufacture
If the polyurethane layer has low melting temperature for easy transfer, then the transfer process becomes simpler, but the clamping becomes unstable over time under mechanical stress
Solution Approach 1:
The polyurethane layer is applied as a thin local adhesive layer (0.01-0.05 mm) only where needed for bonding, rather than as a thick uniform layer. This localized application provides sufficient adhesion for transfer while minimizing the material that could deform under stress, maintaining clamping stability over time.
Solution Approach 2:
The patent optimizes the polyurethane layer thickness to 0.01-0.05 mm and melting temperature to 80-120°C. This parameter optimization allows easy transfer at low temperatures while preventing excessive deformation under mechanical stress, maintaining stable clamping over time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system ensures stable and consistent electrical conduction along the conductive track, maintains clamping over time, and provides high thermal and dimensional stability, preventing mechanical stress and aging from affecting the conductive performance and device quality.
Implementation Method 1
the support layer being duly modified on both its surfaces through a chemical treatment aimed at changing the surface tension of the polymer film itself through an activation system containing an activating agent
Implementation Method 2
a lower layer implemented with a generic low-melting polyurethane film, in particular a low-melting polyurethane layer, having a melting temperature not higher than 150° C.
Implementation Method 3
a support layer containing a polymer thermostabilized at a temperature not higher than 150° C. and with a dimensional variation not greater than 0.2% when subjected to a thermal treatment
Data Source
AI summary
System with at least two layers as a mean or system for transferring electrically conductive ink adapted to receive and transfer said ink on a textile substrate by a thermal transfer.