Dual-Layer Resistor Structure for ESD-Protected High Resistance
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Solution Overview
Problem
Existing thin-film and thick-film resistors face issues with electrostatic discharge (ESD) damage and micro short circuits due to high electric fields and material properties, respectively, limiting their high-resistance circuit designs.
Innovation Solution
A resistor design featuring a thin-film resistive layer on one surface and a thick-film resistive layer on the opposite surface, with the thick-film layer having a dielectric property to absorb ESD and surge voltage, while the thin-film layer maintains high precision and stability, and both layers are connected by protection layers for added reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the number of curved circuit patterns is increased to achieve high-resistance circuit design, then the resistance value is improved, but the distance between adjacent circuits becomes too close causing large electric field and ESD damage
Solution Approach 1:
The invention divides the resistive function into two separate layers: a thin-film resistive layer for precise resistance control and a thick-film resistive layer for ESD protection. This segmentation allows each layer to specialize in one function, resolving the contradiction between achieving high resistance and preventing ESD damage.
Solution Approach 2:
The invention transitions from a single-plane circuit design to a three-dimensional stacked structure with resistive layers on opposite sides of the substrate. This dimensional change allows current paths to be separated in the vertical direction, reducing lateral electric field intensity and preventing ESD while maintaining high resistance.
2Reliability
If the thickness of the thick-film resistive layer is increased or laser cutting pattern is adjusted to reduce surface current density, then ESD protection is improved, but micro short circuit occurs due to material properties
Solution Approach 1:
The invention applies different material properties to different layers: the thin-film layer uses materials with low temperature coefficients for precision, while the thick-film layer uses glass and semiconductor materials for ESD protection. This local differentiation of material quality allows each layer to excel at its specific function without compromising the other.
Solution Approach 2:
The invention creates a composite resistor structure combining thin-film and thick-film resistive layers on opposite sides of a substrate. This composite structure integrates the precision characteristics of thin-film materials with the surge absorption capabilities of thick-film materials, achieving both high precision and high reliability.
3Manufacturing precision
If a single thin-film resistive layer is used, then high precision electrical properties are achieved, but ESD protection is insufficient
Solution Approach 1:
The invention segments the protective and resistive functions into separate layers, with the thin-film layer dedicated to precision electrical properties and the thick-film layer dedicated to ESD protection, eliminating the need to compromise between precision and protection in a single layer.
Solution Approach 2:
The substrate acts as an intermediary between the thin-film and thick-film layers, electrically isolating them while mechanically supporting both. This allows the thin-film layer to maintain its precision characteristics without being directly exposed to ESD stress, which is absorbed by the thick-film layer.
4Reliability
If a single thick-film resistive layer is used, then ESD protection is improved, but manufacturing precision and stability are reduced
Solution Approach 1:
The invention separates the ESD protection function (handled by the thick-film layer) from the precision resistance function (handled by the thin-film layer), allowing the thick-film layer to be optimized for surge absorption without compromising the precision characteristics of the thin-film layer.
Solution Approach 2:
The invention applies thin-film material technology specifically to the resistive layer where precision is critical, while using thick-film glass and semiconductor materials in the protective layer where surge absorption is the priority. This local optimization of material quality achieves both high precision and high reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resistor achieves high-thermal conductivity, high-surge absorption, and high-stable reliability, effectively protecting the thin-film layer from ESD and maintaining precise electrical properties.
Implementation Method 1
the thick-film resistive layer has the dielectric property of glass, it can be used as an absorption layer of ESD and surge voltage
Implementation Method 2
the thin-film resistive layer is disposed on the first surface and contacts the pair of inner electrodes, in which the thin-film resistive layer has a first resistance value
Implementation Method 3
the disclosed resistor (i.e., one resistor having both the thin-film resistive layer and the thick-film resistive layer) of the disclosed structure has the resistance characteristics of high-thermal conductivity
Data Source
AI summary
A resistor includes a substrate, a pair of inner electrodes, a thin-film resistive layer, a pair of backside electrodes, and a thick-film resistive layer. The substrate includes a first surface and a second surface opposite to the first surface. The pair of inner electrodes is disposed on two opposite ends of the first surface, respectively. The thin-film resistive layer is disposed on the first surface and contacts the pair of inner electrodes, wherein the thin-film resistive layer has a first resistance value and includes a trimming groove. The pair of backside electrodes is disposed on two opposite ends of the second surface, respectively. The thick-film resistive layer is disposed on the second surface and contacts the pair of backside electrodes, wherein the thick-film resistive layer has a second resistance value, and the second resistance value is greater than 100 times of the first resistance value.