Dual-Layer SSD Packaging with Asymmetric Sidewalls
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Solution Overview
Problem
There is a need to increase the capacity and reduce the volume of solid state drive (SSD) apparatuses while maintaining performance and strength, as existing SSDs face challenges in efficiently packaging semiconductor chips within a compact form factor.
Innovation Solution
The SSD apparatus incorporates a body with a base plate and sidewalls, featuring a first package substrate module with semiconductor chips on both surfaces of a base substrate and a second package substrate module, where the chips are housed in recess and penetration chip housing portions, allowing for a dual-layered configuration that reduces overall thickness while maintaining capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If semiconductor chips are mounted on both upper and lower surfaces of package base substrates in a dual-layered configuration, then storage capacity is increased, but manufacturing complexity increases
Solution Approach 1:
The patent transitions from a single-layer configuration to a dual-layer configuration by utilizing both upper and lower surfaces of package base substrates. This dimensional change allows storage capacity to be doubled without increasing the footprint area, effectively adding a third dimension (z-axis) to the packaging architecture.
Solution Approach 2:
The SSD apparatus is segmented into multiple independent package substrate modules, each containing semiconductor chips on both surfaces. This segmentation allows for modular manufacturing where each module can be assembled and tested independently before integration into the final product, thereby managing manufacturing complexity through divide-and-conquer.
2Volume of moving object
If the SSD apparatus uses a compact form factor with reduced thickness, then volume is decreased, but packaging space for semiconductor chips is limited
Solution Approach 1:
The patent employs a nested packaging structure where semiconductor chips are mounted on both the upper and lower surfaces of package base substrates, with additional chips positioned on the sidewalls. This nesting approach maximizes the use of available three-dimensional space within the compact form factor, effectively packing more storage capacity into a smaller volume.
Solution Approach 2:
The invention utilizes three-dimensional packaging by mounting chips on both upper and lower surfaces of substrates, and potentially on sidewalls, thereby transforming from a two-dimensional surface mounting approach to a three-dimensional volume utilization approach. This allows increased packaging space within the same footprint and reduced thickness.
3Volume of moving object
If asymmetric sidewall heights are used in the body structure, then space utilization is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent employs an asymmetric body structure where the upper sidewall and lower sidewall have different heights. This asymmetry is deliberately designed to optimize space utilization for the dual-layer package substrate modules, allowing the upper module to have more vertical clearance than the lower module. The asymmetric design is manufactured as an integrated structure to maintain precision.
Data Source
AI summary
A solid state drive (SSD) apparatus includes a body including a base plate and a sidewall extending along a periphery of the base plate, the sidewall including an upper sidewall protruding from an upper surface of the base plate and a lower sidewall protruding from a lower surface of the base plate, a first package substrate module housed in an area defined by the upper surface of the base plate and the upper sidewall, and a second package substrate module housed in an area defined by the lower surface of the base plate and the lower sidewall, wherein a height of the upper sidewall is greater than a height of the lower sidewall.