Dual Lens LED Package for Lateral Light Emission

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Solution Overview

Problem

Conventional light emitting diode (LED) packages face challenges in manufacturing due to complex lens structures, difficulty in forming precise connections, air bubble issues during resin filling, and temperature limitations, which affect optical characteristics and manufacturing processes.

Innovation Solution

A dual lens structure is introduced, comprising a lower lens and an upper lens that are separately molded and bonded, with a transparent encapsulant and heat conducting parts, allowing for efficient lateral light emission and simplified manufacturing, using materials like epoxy molding compound, silicone, or epoxy resin that maintain stability at higher temperatures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Use of energy by moving object

If a single complex LED lens structure is used for lateral light emission, then light emission efficiency is improved, but manufacturing precision deteriorates due to difficulty in forming precise connections and vertices

Engineering Contradiction:
Improvelight emission efficiencyVSAvoidconnection part precision
Core Design Contradiction:
Use of energy by moving objectVSManufacturing precision

Solution Approach 1:

The patent divides the single complex LED lens into two separate lenses: an upper lens and a lower lens. Each lens has a simplified structure with fewer geometric features that require high precision. The upper lens includes a reflecting surface and first refracting surface, while the lower lens includes a second refracting surface. This segmentation eliminates the need to form complex connection parts and inner vertices in a single mold, thereby improving manufacturing precision while maintaining lateral light emission efficiency.

Inventive Principle:
Principle #1Segmentation

2Use of energy by moving object

If a single complex LED lens structure is used, then light emission performance is improved, but device complexity increases making the structure harder to manufacture

Engineering Contradiction:
Improvelight emission performanceVSAvoidlens structure complexity
Core Design Contradiction:
Use of energy by moving objectVSDevice complexity

Solution Approach 1:

The patent segments the complex single lens into two simpler lenses with distinct functions. The upper lens handles light reflection and initial refraction, while the lower lens handles final refraction. This segmentation reduces the geometric complexity of each individual lens, making them easier to manufacture while collectively achieving the desired light emission performance.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent combines the two separately manufactured lenses into a unified optical system by positioning them in specific spatial relationships. The upper and lower lenses are assembled together with their optical axes aligned, creating a composite lens system that achieves the complex optical functionality through simpler component structures.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If resin is filled in the LED lens space to house the LED chip, then encapsulation is achieved, but air bubbles are trapped degrading optical characteristics

Engineering Contradiction:
Improveencapsulation qualityVSAvoidair bubbles
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent divides the encapsulation process into two separate stages corresponding to the two lenses. First, the lower lens is filled with transparent resin and the LED chip is mounted. Then, the upper lens is separately filled with resin. This segmentation of the filling process creates multiple opportunities for air bubbles to escape during each filling stage, rather than trapping them in a single large cavity, thereby improving encapsulation quality and reducing optical degradation.

Inventive Principle:
Principle #1Segmentation

4Ease of manufacture

If conventional LED lens material is used, then moldability is improved, but temperature processing capability deteriorates due to deformation at high temperatures

Engineering Contradiction:
ImprovemoldabilityVSAvoidheat resistance
Core Design Contradiction:
Ease of manufactureVSTemperature

Solution Approach 1:

The patent employs transparent resin materials with enhanced thermal stability for both the upper and lower lenses. These resin materials are specifically selected to maintain dimensional stability and optical properties at elevated temperatures during mounting and operation processes. The composite resin formulation provides both good moldability for manufacturing and resistance to thermal deformation, resolving the contradiction between ease of manufacture and temperature processing capability.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The dual lens structure simplifies manufacturing, reduces air bubble issues, enhances optical performance, and allows for higher temperature processing, resulting in a more efficient and reliable LED package for backlight modules.

Implementation Method 1

an axially symmetrical reflecting surface for laterally reflecting light from the lower lens

Methodology Applied
Scientific EffectReflection: Reflection

Implementation Method 2

an upper part having a reflecting surface I and a refracting surface H, and a lower part having a refracting surface 12

Methodology Applied
Scientific EffectRefraction: Refraction

Data Source

PatentUS7458703B2Light emitting diode package having dual lens structure for lateral light emission
Publication Date: 2008.12.02 SAMSUNG ELECTRONICS CO LTD
  • US7458703B2 patent drawing
  • US7458703B2 patent drawing
  • US7458703B2 patent drawing

AI summary

An LED package having a dual structure for lateral emission of light includes an LED chip, a lower structure, a lower lens and an upper lens. The lower structure includes a pair of electric connection parts, a package body, and a transparent encapsulant filled in the recess of the package body to seal the LED chip. The upper-hemispheric lower lens is fixed to an upper part of the lower structure with a bottom part thereof attached to an upper surface of the transparent encapsulant. The funnel-shaped upper lens is fixed to an upper end of the lower lens, and includes an axially symmetrical reflecting surface for laterally reflecting light from the lower lens, and an emitting surface for laterally emitting light reflected from the reflecting surface. The upper lens and the lower lens are separately molded and combined together to easily manufacture and efficiently install the LED package.