Dual-Lens Modules With Opaque Barrier For Proximity Sensors
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Solution Overview
Problem
Manufacturing multiple lens devices poses challenges due to the need for precise positional control of small lenses, which can result in cross-talk and labor-intensive processes, especially when lenses are close together and require an opaque barrier to prevent signal interference.
Innovation Solution
The process involves cutting a glass wafer into small chips, embedding them in a molding compound, and forming optical plastic into lens faces, allowing for precise control of lens spacing and assembly, similar to semiconductor manufacturing techniques, to create dual-lens modules with glass bodies and plastic faces embedded in molding compound.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multiple lenses are positioned close together to reduce device size, then device compactness is improved, but cross-talk between lenses increases
Solution Approach 1:
The patent divides the lens array into discrete, isolated units by embedding individual lenses in separate cavities within a substrate. This segmentation physically separates the lenses, preventing cross-talk while maintaining compact positioning. Each lens is isolated in its own cavity, creating effective partitions that block optical interference between adjacent lenses.
Solution Approach 2:
The patent introduces an intermediary material (encapsulant or adhesive) that fills the spaces between lenses and provides optical isolation. This intermediary substance acts as a barrier to prevent light from one lens from reaching adjacent lenses, thereby eliminating cross-talk while allowing the lenses to remain in close proximity for compact device design.
2Manufacturing precision
If lenses are mounted to a single structure for precise positional control, then positioning accuracy is improved, but manufacturing complexity increases
Solution Approach 1:
The patent performs preliminary positioning by embedding lenses in predetermined cavities within a substrate before final device assembly. The substrate is pre-formed with cavities at precise locations, and lenses are placed into these pre-positioned sites. This preliminary action ensures accurate lens positioning while simplifying the overall manufacturing process, as the substrate structure itself provides the positioning framework rather than requiring complex post-assembly adjustments.
Solution Approach 2:
The substrate structure provides self-positioning functionality through its pre-formed cavities, which automatically guide and secure lenses at the correct positions during assembly. The cavity geometry and substrate design inherently ensure proper lens placement without requiring additional positioning mechanisms or complex manufacturing steps, allowing the structure to serve its own positioning function.
3Object-generated harmful factors
If an opaque barrier is added between lenses to prevent cross-talk, then cross-talk is reduced, but manufacturing labor increases
Solution Approach 1:
The patent merges the opaque barrier function with the substrate structure itself. The substrate is designed to inherently provide optical isolation between lenses through its material properties and structural design, eliminating the need for separate opaque barrier components. The encapsulant or adhesive material used to mount lenses also serves the dual function of structural bonding and optical isolation, combining multiple functions into a single integrated solution that reduces manufacturing steps and labor.
Data Source
AI summary
A method comprises depositing an optical filter layer on a glass wafer, then cutting the wafer into dice. The dice are positioned on a carrier and encapsulated in a molding compound to form a reconstituted wafer, and the wafer is back-ground and polished. Lens faces are positioned on opposing surfaces of the glass dice and spacers are positioned on one side of the wafer. The wafer is then cut into lens modules, each having two side-by-side lenses with an opaque molding compound barrier between. The individual modules are attached to devices that require dual lenses, such as, e.g., proximity sensors that use a light source and a light receiver or detector.