Dual-Level Cold Plate Layout for Uniform Multi-Die Cooling
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Solution Overview
Problem
Existing cooling systems for semiconductor modules, particularly those with multiple dies, struggle to maintain uniform temperature distribution and efficient heat dissipation, leading to thermal degradation and performance limitations.
Innovation Solution
A dual level cold plate with an upper and lower level separated by an air gap, featuring channels for fluid flow, and a mechanism to reverse fluid direction based on die utilization, ensuring even cooling across multiple semiconductor dies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a single-level cold plate is used for cooling multiple semiconductor dies, then the structure is simple, but uniform temperature distribution cannot be achieved across all dies
Solution Approach 1:
The cold plate is divided into two separate levels: an upper level and a lower level. Each level has its own set of channels for fluid flow. This segmentation allows independent thermal management of different die layers, achieving uniform temperature distribution across multiple semiconductor dies without excessive complexity
Solution Approach 2:
The cooling system transitions from a single-plane (2D) cooling approach to a multi-level (3D) cooling architecture. By stacking cooling channels in vertical layers separated by an air gap, the system achieves comprehensive thermal coverage across multiple die levels, improving temperature uniformity while maintaining structural efficiency
2Reliability
If fluid flow direction is fixed in the cold plate, then the system is simple to operate, but thermal degradation occurs due to non-uniform cooling as die utilization changes
Solution Approach 1:
The cold plate incorporates reversible fluid flow capability, allowing the direction of coolant circulation to be dynamically changed between forward and reverse directions. This dynamic adjustment enables the system to adapt to varying die utilization patterns, ensuring reliable thermal management under different operating conditions without requiring complex control mechanisms
Solution Approach 2:
The system uses temperature sensor feedback from multiple locations to monitor thermal conditions across the semiconductor dies. Based on this feedback, the control system adjusts the fluid flow direction to optimize cooling effectiveness, improving operational reliability while maintaining ease of operation through automated temperature-based control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The dual level cold plate provides effective and even cooling of multiple semiconductor dies, reducing thermal gradients and preventing operational degradation by maintaining uniform temperature distribution.
Implementation Method 1
a cold plate adapted for thermal management of multiple semiconductor dies... lower level including a second plurality of channels that are adapted to allow the cooled fluid to flow therethrough, where the lower level is adjacent to the multiple semiconductor dies
Implementation Method 2
a first plurality of channels that are adapted to allow a cooled fluid to flow therethrough... a first flow path to move the fluid to the at least one cold plate, and a second flow path to move the fluid away from the at least one cold plate
Data Source
AI summary
An apparatus that includes a cold plate adapted for thermal management of multiple semiconductor dies. The cold plate includes an upper level including a first plurality of channels that are adapted to allow a cooled fluid to flow therethrough, a lower level including a second plurality of channels that are adapted to allow the cooled fluid to flow therethrough, where the lower level is adjacent to the multiple semiconductor dies, and an airgap located between the upper level and the lower level.