Display Panel Dual-Line Structure for Driving-Chip Crack Prevention
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Solution Overview
Problem
The physical attachment of driving chips to display panels can cause cracks and defects in the display panel, leading to signal cutoff and screen abnormalities.
Innovation Solution
A dual line configuration is implemented between the substrate and protection layer, along with dummy electrodes on the same layer as the first line, to minimize cracks and delamination around the driving chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If driving chips are physically attached to the display panel, then the display apparatus can be made lightweight and thin, but cracks and defects occur in the display panel causing screen abnormalities
Solution Approach 1:
A dual line configuration is introduced as an intermediary structure between the substrate and protection layer. This dual line acts as a mediator that absorbs and distributes the physical stress generated during driving chip attachment, preventing direct transmission of harmful forces to the display panel and thereby avoiding cracks and screen defects while maintaining the lightweight and thin design.
Solution Approach 2:
The dual line configuration is预先 (in advance) designed and positioned to provide cushioning protection before the driving chip attachment process occurs. This preventive structure absorbs the impact and stress forces beforehand, preventing cracks and defects from occurring during the bonding process, thus ensuring screen reliability from the outset.
2Adaptability or versatility
If driving chips are physically attached to the display panel, then driving functions are integrated into the panel, but delamination occurs around the driving chip causing gate line disconnection
Solution Approach 1:
The dual line configuration serves as an intermediary bonding structure between the substrate and protection layer around the driving chip. This intermediary structure enhances interlayer adhesion by providing additional bonding interfaces, preventing delamination and gate line disconnection while maintaining driving chip integration and electrical connectivity.
3Device complexity
If a single line configuration is used between substrate and protection layer, then the structure is simple, but cracks and delamination occur when attaching driving chips
Solution Approach 1:
The single line configuration is segmented into a dual line configuration, dividing the stress-bearing function into two separate lines. This segmentation allows each line to independently handle portions of the mechanical stress during driving chip attachment, preventing crack propagation and delamination while maintaining relatively simple overall structure.
Data Source
AI summary
A display apparatus may comprise a substrate including a display area and a non-display area around the display area, a gate driving part disposed at the non-display area on the substrate, a driving chip disposed at the non-display area on the substrate, a first line disposed on the substrate, the first line electrically connected to the driving chip, and a second line disposed between the substrate and the first line.