Dual Lining Reaction Chamber for Plasma Etching Uniformity
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Solution Overview
Problem
Current semiconductor manufacturing processes face issues with etching uniformity due to gaps between moving parts and manufacturing errors, leading to uneven plasma distribution and etching results.
Innovation Solution
A reaction chamber design featuring a chamber body with a dual inner lining system and a lifting drive device that adjusts to block the wafer transfer opening, ensuring plasma confinement and protecting the chamber walls, while maintaining airflow uniformity through a gap and overlapping mechanism.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a single inner lining is used in the reaction chamber, then the structure is simple, but the etching uniformity is poor due to gaps and manufacturing errors affecting plasma distribution
Solution Approach 1:
The inner lining is divided into two separate linings (first inner lining and second inner lining) that can be independently positioned and adjusted. This segmentation allows each lining to be optimized for specific functions: the first lining provides structural support while the second lining controls plasma distribution, thereby improving etching uniformity without requiring a single complex component
Solution Approach 2:
The second inner lining is nested within or alongside the first inner lining, forming a concentric or overlapping configuration. This nested structure enables precise control of the gap between linings, which is critical for maintaining uniform plasma distribution across the wafer surface, while keeping the overall structure compact and manageable
2Ease of operation
If the inner door is used to block the wafer transfer opening, then the wafer transfer is enabled, but the inner wall of the reaction chamber is exposed to plasma and becomes etched
Solution Approach 1:
The second inner lining acts as an intermediary component that extends to block the wafer transfer opening when the inner door is open. This intermediary structure prevents direct exposure of the chamber wall to plasma during wafer transfer operations, eliminating the harmful etching effect while maintaining full wafer transfer functionality
Solution Approach 2:
The second inner lining is designed to be movable, extending to block the transfer opening when needed and retracting when not needed. This dynamic configuration allows the system to adapt its protective function based on operational requirements, preventing chamber wall etching during transfer operations while maintaining plasma access during processing
3Ease of manufacture
If the gap between inner linings is large, then the manufacturing and assembly is easier, but the plasma distribution becomes uneven affecting etching consistency
Solution Approach 1:
The invention optimizes the gap parameter between the two inner linings to a specific range that balances manufacturability with plasma uniformity. By carefully controlling this dimensional parameter, the system achieves adequate plasma distribution without requiring extremely tight manufacturing tolerances, thus maintaining ease of assembly while ensuring etching consistency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances etching uniformity and stability, ensuring consistent results from the center to the edge of the wafer, thereby increasing product yield and process reliability.
Implementation Method 1
The first inner lining and the second inner lining enclose a process area configured to perform the process processing on the wafer
Implementation Method 2
High-frequency energy generated by an upper electrode radio frequency antenna 01 passes through a dielectric window 03 to ionize the process gas under the dielectric window 03 into plasma 04
Data Source
AI summary
A reaction chamber includes a chamber body, an inner lining, and a lifting drive device. The inner lining is arranged in the chamber body. A wafer transfer opening is arranged at a sidewall of the chamber body. The inner lining includes a first inner lining and a second inner lining. The first inner lining is fixedly connected to the chamber body. The second inner lining is coaxially sleeved outside or inner sleeved at the first inner lining. The first inner lining and the second inner lining include a gap in a horizontal direction. The lifting drive device is configured to be connected to the second inner lining, when performing process processing on a wafer, drive the second inner lining to a predetermined first position to cause the second inner lining to cover the wafer transfer opening and the first inner lining and the second inner lining to partially overlap.