Dual-Loop Immersion Cooling with Cold Plates for HPC Chips
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Solution Overview
Problem
In high-performance computing environments, such as data centers, the existing immersion cooling systems face challenges in effectively cooling high-performance semiconductor chips due to high fluidic impedance in narrow spaces between circuit boards, leading to insufficient heat transfer from these chips to the cooling liquid.
Innovation Solution
The implementation of a dual primary cooling loop system, where a colder and faster fluid flow is directed through cold plates mounted on high-performance chip packages, overcoming the impedance issues and enhancing heat removal capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single primary cooling loop is used in immersion cooling systems, then the system structure is simple, but the heat transfer efficiency from high-performance semiconductor chips is insufficient due to high fluidic impedance in narrow spaces
Solution Approach 1:
The cooling system is segmented into two independent primary loops: a first primary loop that circulates cooling fluid through the immersion chamber to cool general electronics, and a second primary loop that specifically targets high-performance semiconductor chips through cold plates. This segmentation allows each loop to be optimized for its specific cooling task, overcoming the fluidic impedance issues in narrow spaces by providing dedicated high-flow paths for high-heat-generation components.
2Volume of moving object
If cooling fluid flows through narrow spaces between circuit boards, then the system maintains compact arrangement, but fluidic impedance increases causing insufficient heat transfer
Solution Approach 1:
Cold plates are introduced as intermediary heat transfer devices mounted on high-performance chip packages. These cold plates provide dedicated fluid flow channels that bypass the narrow spaces between circuit boards, eliminating fluidic impedance issues while maintaining the compact immersion chamber arrangement. The cold plates act as mediators between the chips and the cooling fluid, ensuring efficient heat transfer without requiring increased spacing.
3Ease of operation
If a single cooling loop is used, then the system is easy to operate, but it cannot provide both general immersion cooling and targeted cold plate cooling simultaneously
Solution Approach 1:
The cooling system is divided into two independent primary loops with separate pumps, heat exchangers, and fluid pathways. The first primary loop handles general immersion cooling of the chamber, while the second primary loop specifically serves cold plates mounted on high-performance chips. This segmentation enables simultaneous operation of both cooling modes without interference, while each loop can be independently controlled and optimized for its specific function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for more efficient cooling of high-performance semiconductor chips by ensuring a colder and faster fluid flow, thereby improving heat transfer and reducing the temperature of the chips, even in constrained spaces.
Implementation Method 1
The liquid 102 has a higher heat transfer coefficient than air which enables heat to be removed from the electrical components more effectively
Implementation Method 2
The heat exchanger 106 transfers heat from the warmed fluid to another liquid within a secondary cooling loop 107
Data Source
AI summary
An apparatus is described. The apparatus includes a coolant distribution unit having a first primary loop output to provide first cooled immersion liquid to an immersion chamber and a second primary loop output to provide second cooled immersion liquid to one or more cold plates within the immersion chamber.