Dual-Loop Liquid Cooling Module for Projection Device Heat Dissipation
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Solution Overview
Problem
Current heat dissipation systems in solid-state light source projection systems face challenges with thermal resistance, especially when heat increases, leading to inefficiencies in air cooling and liquid cooling methods, particularly in terms of space utilization and noise levels.
Innovation Solution
The implementation of a heat dissipation module with two independent liquid cooling loops, where the first loop dissipates heat from first heat sources with lower operating temperatures and the second loop dissipates heat from second heat sources with higher operating temperatures, allowing for improved heat dissipation efficiency without increasing fan count or noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the heat sink area is increased to improve heat dissipation, then the heat dissipation area is increased, but the volume of the heat dissipation module increases and space utilization rate deteriorates
Solution Approach 1:
The patent divides the heat dissipation system into two independent liquid cooling loops, each with its own heat sink. This segmentation allows each heat sink to be optimized for specific heat sources (DLP chip and laser module) without requiring a single large heat sink, thereby improving heat dissipation efficiency while controlling the overall volume of the heat dissipation module.
2Productivity
If the number of fans is increased to improve cooling performance, then the cooling performance is improved, but the system noise increases
Solution Approach 1:
The patent adopts liquid cooling technology to replace or supplement air cooling with fans. By using liquid circulation to transfer heat from the heat sources to heat sinks, the system achieves effective cooling performance without relying on high-speed fans, thereby reducing system noise while maintaining or improving cooling efficiency.
3Reliability
If the liquid cooling system is used to reduce thermal resistance, then the heat exchange efficiency is improved, but the system complexity increases
Solution Approach 1:
The patent designs a liquid cooling system where a single circulation system serves multiple heat sources (DLP chip and laser module) through two independent loops. This multi-functional design allows the liquid cooling system to handle different heat dissipation requirements simultaneously, improving heat exchange efficiency while managing system complexity through standardized components and modular architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances heat dissipation efficiency, allows for increased heat dissipation area without additional fans, and reduces fan rotation speed to minimize system noise, thereby improving overall performance and usability.
Implementation Method 1
a liquid medium flows through the first heat sink for heat exchange and then flows to the first heat source for circulating heat dissipation
Implementation Method 2
the liquid medium flows through the first heat sink for heat exchange and then flows to the first heat source for circulating heat dissipation
Data Source
AI summary
A heat dissipation module, configured for heat dissipation of at least one first heat source and at least one second heat source, and including a first heat sink, a second heat sink, a first pipe, and a second pipe, is provided. The first heat sink and the first heat source are connected to each other through the first pipe to form a first loop, so that a liquid medium flows through the first heat sink for heat exchange and then flows to the first heat source for circulating heat dissipation. The second heat sink and the second heat source are connected to each other through the second pipe to form a second loop, so that the liquid medium flows through the second heat sink for heat exchange and then flows to the second heat source for circulating heat dissipation. A projection device, including the heat dissipation module, is also provided.