Dual-Loop Immersion Cooling for High-Power Computer Components
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Solution Overview
Problem
Current liquid cooling systems for high-performance computing, such as immersion cooling and direct-to-chip cooling, are inadequate in cooling capacity and can lead to leaks, posing risks to computer operation and scalability issues.
Innovation Solution
An immersion cooling system with a dual cooling loop design, where a first loop immerses computer equipment in a dielectric liquid and a second loop directly distributes coolant to heat sinks via pipes and nozzles, ensuring efficient and uniform coolant distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If immersion cooling is used to cool entire computers in a dielectric liquid tank, then cooling capability is limited to about 500 W, but the system is simple to implement
Solution Approach 1:
The cooling system is segmented into two independent cooling loops: a first cooling loop for immersion cooling of entire computer systems and a second cooling loop for direct-to-chip cooling of high-power components. This segmentation allows each loop to be optimized for its specific function, enabling the system to handle higher total power loads while maintaining implementation simplicity through modular architecture
Solution Approach 2:
The patent merges immersion cooling and direct-to-chip cooling into a single integrated system that shares common components such as the dielectric liquid coolant, pump, and tank. This combining approach allows the system to achieve higher cooling capability (beyond 500 W) while avoiding the complexity of having completely separate cooling systems
2Power
If direct-to-chip cooling with water-based liquid is used, then cooling capability is higher, but leaks can occur causing short circuits
Solution Approach 1:
The patent changes the physical-chemical parameters of the coolant by using dielectric liquid instead of water-based liquid in the direct-to-chip cooling loop. This parameter change maintains the high cooling capability of direct-to-chip cooling while eliminating the risk of electrical short circuits, as dielectric liquids do not conduct electricity
Solution Approach 2:
The dielectric liquid acts as an intermediary coolant that transfers heat from high-power components while providing electrical insulation. This intermediary substance enables the system to achieve both high cooling capability and safety by mediating between the thermal management function and electrical isolation requirement
3Adaptability or versatility
If immersion cooling is used, then the entire computer is cooled, but cooling capability is insufficient for high-power processors
Solution Approach 1:
The cooling approach is segmented into two complementary methods: immersion cooling for general computer system cooling and direct-to-chip cooling for high-power processor cooling. This segmentation allows the system to provide comprehensive cooling coverage while achieving sufficient cooling capability for high-power components through the targeted direct-to-chip approach
4Adaptability or versatility
If a single cooling system is designed for both immersion and direct-to-chip cooling, then scalability is improved, but system complexity increases
Solution Approach 1:
The patent designs a universal cooling system that can perform multiple functions through two cooling loops sharing common components. The system can cool single computers or multiple computers, and can switch between immersion cooling mode and direct-to-chip cooling mode, providing scalability while managing complexity through multi-functionality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves enhanced cooling capacity, reducing temperatures by 10.5°C for heat-generating components, while using a single dielectric coolant type, improving flowrate and safety, and facilitating scalability.
Implementation Method 1
liquid coolant to cool one or more computers
Implementation Method 2
liquid coolant that is circulated to cool one or more computers
Implementation Method 3
a pump having a pump inlet and a pump outlet coupled to the first tank inlet
Data Source
AI summary
An immersion cooling system includes a tank configured to hold liquid coolant and one or more instances of computer equipment submerged within the liquid coolant The tank is configured to have a first tank inlet, a second tank inlet, and a tank outlet. The immersion cooling system further includes a pump configured to have a pump inlet and a pump outlet coupled to the first tank inlet. The immersion cooling system further includes a coolant distribution unit (CDU) configured to have a distribution inlet coupled to the tank outlet and a distribution outlet that is coupled to the second tank inlet and the pump inlet.