Dual-Loop Liquid Cooling for Electronic Module Heat Management
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Solution Overview
Problem
Existing cooling systems for electronic modules, particularly in high-performance computing environments, face inefficiencies as they struggle to manage increasing heat generation due to reduced footprints and higher power demands, often requiring complex and expensive custom installations.
Innovation Solution
A hybrid cooling system comprising two circulatory arrangements: a first circulatory arrangement for general cooling using a dielectric liquid and a second, more efficient circulatory arrangement using water, with a heat exchanger to transfer heat from the first to the second, allowing targeted high-performance cooling for specific components and overall module temperature regulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If air cooling is used for electronic modules, then the system is simple and cost-effective, but the cooling efficiency is insufficient for high-performance devices
Solution Approach 1:
The patent transitions from air cooling to liquid cooling by circulating coolant through channels in contact with electronic devices. The hydraulic system uses pumps and fluid dynamics to achieve superior heat transfer coefficients, resolving the contradiction between simplicity and cooling efficiency for high-performance devices.
Solution Approach 2:
The patent changes the physical state and properties of the cooling medium from gas (air) to liquid (coolant), fundamentally altering the heat transfer parameters. This parameter change enables significantly higher cooling capacity while maintaining system integration through standardized liquid cooling components.
2Loss of energy
If liquid cooling is implemented for high-performance devices, then cooling efficiency improves, but system complexity and installation cost increase
Solution Approach 1:
The patent creates a hybrid cooling system where a single liquid cooling infrastructure serves multiple functions: cooling high-performance devices through dedicated channels and providing general ambient cooling for the entire module. This multi-functionality reduces overall system complexity compared to implementing separate cooling systems for different device types.
Solution Approach 2:
The patent segments the cooling approach by applying liquid cooling selectively to high-performance devices that require it, while other devices benefit from the general cooling effect. This segmentation allows the system to achieve high cooling efficiency where needed without the complexity of full-system liquid cooling.
3Reliability
If multiple separate cooling systems are used for different electronic devices, then each device can be cooled optimally, but the system becomes complex and expensive
Solution Approach 1:
The patent merges multiple cooling functions into a single integrated liquid cooling system. The coolant circulation system serves both high-performance devices requiring direct cooling and provides general cooling for the entire electronic module, reducing the number of separate systems while maintaining optimal cooling performance for critical components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The hybrid system provides efficient and flexible cooling, reducing coolant usage, minimizing leaks, and enhancing reliability while allowing higher performance operation of electronic components by leveraging the efficiency of the second circulatory arrangement to cool both high and low-power components effectively.
Implementation Method 1
Coolant circulating within the first cooling circulatory arrangement is cooled by transfer of heat, via a heat exchanger, to coolant circulating in the second cooling circulatory arrangement
Implementation Method 2
transfer of heat, via a heat exchanger
Implementation Method 3
a first cooling circulatory arrangement which is arranged to cool a first electronic device within the electronic module
Data Source
Figure 1
Figure 2~3
Figure 4A~4B
AI summary
A system and a method for cooling a plurality of electronic devices housed in a housing of an electronic module. The system comprises a first cooling circulatory arrangement, configured to circulate a first liquid coolant between a first electronic device of the plurality of electronic devices and a heat exchanger, the first electronic device being thermally coupled to the first liquid coolant such that heat is transferred from the first electronic device to the first liquid coolant. The system further comprises a second cooling circulatory arrangement, configured to circulate a second liquid coolant between a second electronic device of the plurality of electronic devices and the heat exchanger, the second electronic device being thermally coupled to the second liquid coolant such that heat is transferred from the second electronic device to the second liquid coolant. The first cooling circulatory arrangement and the second cooling circulatory arrangement are thermally coupled at least via the heat exchanger, such that heat is transferred from the first liquid coolant to the second liquid coolant via the heat exchanger.