Dual Loop Substrate Support Temperature Control
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Solution Overview
Problem
Existing semiconductor processing equipment is limited by slow temperature ramp-up and ramp-down times, making it difficult to rapidly change substrate temperatures during and between process steps, which is critical for precise control in fabrication processes.
Innovation Solution
A dual heat transfer loop system with two baths and flow controllers is used to rapidly control the substrate support temperature by mixing or pulsing heat transfer fluids of different temperatures, allowing for precise temperature adjustments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single energy exchange system is used to control substrate temperature, then the system structure is simple, but the temperature ramp-up and ramp-down time is slow
Solution Approach 1:
The single energy exchange system is segmented into two separate heat transfer loops, each with its own bath and flow controller. This segmentation allows independent control of heating and cooling processes, enabling rapid temperature changes without the inertia of a single large system.
Solution Approach 2:
The system transitions from a static single-loop configuration to a dynamic dual-loop configuration where flow rates can be independently adjusted. The flow controllers enable real-time modulation of heat transfer fluid flow, allowing the system to rapidly adapt temperature in response to process requirements.
2Ease of operation
If a single energy exchange system is used, then the apparatus is simpler to operate, but changing temperature between process steps is time consuming
Solution Approach 1:
The two baths are prepared in advance with heat transfer fluids at different temperatures (one hot, one cold). This preliminary preparation allows the system to immediately switch between heating and cooling modes by simply adjusting flow ratios, eliminating the time required to heat or cool a single large fluid volume during process transitions.
Solution Approach 2:
The system employs periodic switching between hot and cold fluid delivery through the flow controllers. By alternately pulsing hot and cold fluids to the substrate support, the system can rapidly cycle temperatures between process steps, reducing idle time while maintaining operational simplicity through automated flow control.
3Measurement precision
If heat transfer fluids are mixed prior to entering the substrate support, then temperature control precision is improved, but the system requires additional mixing infrastructure
Solution Approach 1:
The heat transfer fluids from the two baths are used as intermediaries that mix within the substrate support itself rather than requiring a separate mixing chamber. The substrate support acts as the mixing zone where hot and cold fluids combine to achieve the desired temperature, eliminating the need for additional mixing infrastructure while maintaining precise temperature control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables rapid and precise temperature control of substrate supports, facilitating faster processing and reducing time between process steps, thereby improving the efficiency of semiconductor fabrication.
Implementation Method 1
an energy exchanging medium is circulated through a substrate support. Using this system the substrate support may be cooled and/or heated to a desired temperature
Implementation Method 2
The first and second flow controllers may control the temperature of the substrate base by mixing the first and second fluids or by supplying the first and second fluids to the substrate support in flow pulses of sufficient duration to provide the required heat transfer for substrate temperature control
Implementation Method 3
The first and second flow controllers may control the temperature of the substrate base by mixing the first and second fluids
Data Source
AI summary
Apparatus for controlling the temperature of a substrate support may include a first heat transfer loop and a second heat transfer loop. The first heat transfer loop may have a first bath with a first heat transfer fluid at a first temperature. The second heat transfer loop may have a second bath with a second heat transfer fluid at a second temperature. The first and second temperatures may be the same or different. First and second flow controllers may be provided for respectively providing the first and second heat transfer fluids to a substrate support. One or more return lines may couple one or more outlets of the substrate support to the first and second baths for returning the first and second heat transfer fluids to the first and second baths.