Dual mass cooling precision system
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Solution Overview
Problem
Conventional cooling systems for high sensible process heat loads are inadequate as they rely solely on air or liquid cooling, failing to effectively manage heat fluxes that exceed air's capabilities while not being practical for 100% liquid cooling in all scenarios, necessitating a system that can simultaneously utilize both air and liquid cooling.
Innovation Solution
A vapor compression cooling system incorporating a dual air and liquid evaporator that integrates both cooling sub-circuits within a common casing, utilizing a single refrigerant flow path to provide simultaneous air and liquid cooling, with a coaxial tube design for efficient heat transfer and control algorithms to manage temperature and pressure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If air cooling is used for high sensible process heat loads, then the system is simple and practical, but the heat removal capability is insufficient when heat flux exceeds air's capability
Solution Approach 1:
The patent combines air cooling and liquid cooling sub-circuits into a single dual evaporator system with a common casing and shared refrigerant flow path, enabling simultaneous operation of both cooling modes to achieve high heat removal capability while maintaining system compactness and operational simplicity
2Power
If 100% liquid cooling is implemented, then the heat removal capability is maximized, but the system becomes impractical in many scenarios
Solution Approach 1:
The patent enables dynamic switching between air cooling, liquid cooling, and combined cooling modes through a controller that responds to temperature and pressure sensor inputs, allowing the system to adapt to varying heat load conditions and maintain practicality across different operating scenarios while maximizing heat removal capability when needed
3Power
If a dual air and liquid cooling system is implemented, then the heat removal capability is enhanced, but the device complexity increases
Solution Approach 1:
The patent integrates both air cooling and liquid cooling sub-circuits into a single dual evaporator system with a common casing and shared refrigerant flow path, reducing overall system complexity compared to separate cooling systems while maintaining enhanced heat removal capability
Solution Approach 2:
The dual evaporator system serves multiple functions simultaneously - it can operate in air cooling mode, liquid cooling mode, or combined mode, and includes integrated sensors and control logic that manage both cooling circuits through a single system architecture, reducing the need for separate control systems
4Device complexity
If conventional air cooling is used for high watt density equipment, then the system is simple, but power consumption is excessive
Solution Approach 1:
The patent employs dynamic control that switches between air cooling and liquid cooling modes based on real-time temperature and pressure sensor inputs, allowing the system to use energy-efficient liquid cooling when high heat removal is needed while maintaining simplicity by using a single integrated system with automated mode selection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively cools high sensible process loads by combining air and liquid cooling, enhancing heat removal capabilities beyond what air alone can achieve, while ensuring efficient distribution of cooled air and liquid to equipment, supporting higher watt densities and reducing power consumption compared to traditional server air cooling.
Implementation Method 1
heat energy is transferred into a volatile refrigerant that in turn absorbs the heat energy though a two phase process that involves a change from a sub-cooled liquid state to a super-heated vapor state
Implementation Method 2
While in this gaseous state a compressor increases both the temperature and pressure of the gas so as to create the higher temperatures needed to create the differential between the gas temperature and that of the heat removal medium
Implementation Method 3
A conventional cooling system for a high sensible process heat load removes heat from the working space through convective heat transfer through the air
Implementation Method 4
a heat exchanger (evaporator) where heat energy is transferred into a volatile refrigerant
Data Source
AI summary
Devices, systems, and methods are disclosed for cooling using both air and/or liquid cooling sub circuits. A vapor compression cooling system having both an air and liquid cooling sub circuit designed to service high sensible process heat loads that cannot be solely cooled by either liquid or air is provided.